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Rogers Expanding Power Substrate Capacity in China to Meet Growing EV and Renewable Energy Demand
May 10, 2023 | Rogers CorporationEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/4416/9086/9832/news_freeadobestock2_jul2022.jpg)
Rogers Corporation, announced its plan to build a new factory in China to manufacture its curamik AMB (Active Metal Brazed) and DBC (Direct Bonded Copper) substrates to meet significant demand growth. The first phase of the expansion is slated for completion in 2025. This follows last year’s investment in expanding the company’s curamik factory in Eschenbach, Germany.
“To better support our global customers and meet the growing demand for power substrates used in electric and hybrid electric vehicles (EV/HEV) and renewable energy applications, we are planning to build a new state-of-the-art factory in China. Upon completion, this new factory will help shorten lead times and deepen technical collaborations with customers in Asia,” said Jeff Tsao, Advanced Electronic Solutions (AES) Vice President and General Manager. “We have been a trusted partner to leading power module suppliers for decades, delivering efficient and reliable power semiconductor substrates, and today’s announcement further strengthens that position.”
This latest investment continues Rogers’ manufacturing strategy of positioning capacity to serve its global customer base. The company continues to focus on supporting growth opportunities across its markets with ongoing initiatives to drive capacity throughput improvements at existing facilities and make measured investments in new capacity. The expansion plan will be discussed in the company’s Q2 2023 earnings conference call, and any further developments will be communicated at that time. Rogers continues to expect capital expenditures for full-year 2023 to be in the range of $65 to $75 million.
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Connect the Dots: Designing for Reality—Electroless Copper
08/28/2024 | Matt Stevenson -- Column: Connect the DotsRoll up your sleeves because it's time to get messy. In a recent episode of I-Connect007’s On the Line with… podcast, we discussed electroless copper deposition. This process deposits a copper layer into the through-holes and vias of what will eventually be a PCB. Electroless copper deposition feels like a black box to many people. It sort of looks like a black box, too. The boards go in one side, come out the other, and emerge differently. So, let's crack open that black box and look inside.
Maximizing ROI Through Better Wet Process Control
08/20/2024 | I-Connect007 Editorial Team“When things get out of control, the variation in your wet process begins,” says Mike Carano,. “Just because they look like good boards and may even pass electrical test, it does not necessarily mean you have good boards. Once the chemistry is headed toward the right or left side of the process control parameter cliff, the plating is compromised. If the copper is thinner than it should be, when the customer puts it into service, the board may fail after 500 cycles vs. the requisite 1,000 or 2,000 cycles. The root cause issue is that you plated 7/10ths of a mil of copper instead of one-mil of copper because you were not controlling your process. The fact that you passed your own electric test becomes inconsequential.”
The Chemical Connection: Controlling an Alkaline Etch Bath With Low Copper Loading
08/07/2024 | Don Ball -- Column: The Chemical ConnectionThis month, I wanted to continue my discussion on how much process control is actually needed for high-density circuit production. However, in the last month, I have been called on to help with a specific process control problem: how to control an alkaline etch bath when you’re not etching much copper. This problem has been cropping up more frequently as smaller shops (and a few larger ones) concentrate on low-volume, high-value plated through-hole panels such as prototypes, resistor cores, etc.