- 
                                  
- News
-  Books
                        Featured Books
- smt007 Magazine
Latest IssuesCurrent Issue  Production Software IntegrationEMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?   Spotlight on IndiaWe invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.   Supply Chain StrategiesA successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception. 
- Articles
- Columns
- Links
- Media kit||| MENU
- smt007 Magazine
CTTi Partners with Horizon Sales to Open New IPC Training Center in Michigan
May 10, 2023 | CTTiEstimated reading time: Less than a minute
 
                                                                    Circuit Technology Training, Inc. (CTTi) is proud to announce the opening of a new IPC training center in Michigan, hosted by Horizon Sales in Brighton, Michigan. The new facility will expand CTTi’s portfolio of training centers, and will provide a new IPC training resource to electronics manufacturing customers in the Midwest.
Horizon Sales is an equipment and distribution group with over 25 years of experience. Horizon represents the industry’s leading manufacturers for component prep, inventory, storage and warehousing, assembly and soldering. Horizon Supply Group is the Midwest’s leading distributor for all electronics manufacturing needs including solder, fluxes, hand tools, soldering/de-soldering stations, anti-static protection, cleaning chemistries, and more.
CTTi currently has a team of six Master IPC trainers and nine training centers in the US, Costa Rica, and Mexico. CTTi, an organization of 29+ years, began primarily with a focus on the east coast; in the last 3 years, the company has expanded its reach to provide services nationwide both in our training centers and on-location at customer facilities.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    