-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
KYZEN to Focus on Chemistry and Process Control at SMTA Oregon
May 15, 2023 | KyzenEstimated reading time: 1 minute

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Oregon Expo & Tech Forum, scheduled to take place Thursday, June 8, 2023 in Wilsonville, Oregon. The KYZEN team will spotlight the KYZEN Process Control System (PCS), the world’s first and only concentration monitoring and control system, in addition to the award-winning aqueous solutions AQUANOX A4625 and AQUANOX A4626.
The KYZEN PCS controls, monitors, and automatically reacts to the dynamic changes in the wash bath concentration. Since its introduction more than 20 years ago, the capabilities of the KYZEN PCS have continued to improve and advance in the mission of maximizing high-quality output from inline cleaning systems.
AQUANOX A4625 is a highly effective, dispersive cleaning agent with excellent material compatibility designed to clean electronic assemblies in spray-in-air cleaning equipment. It excels in low concentrations and temperatures with proven effectiveness on more than 90% of solder pastes currently in production with additional use in cleaning lead-free and no-clean flux types.
The environmentally-friendly AQUANOX A4626 is reliable with a long tank life and is designed to efficiently remove the latest polymeric no-clean flux residues. The multi-pass, application-safe aqueous spray also delivers excellent results on traditional lead-free and eutectic tin lead residues.
For over 30 years, KYZEN has been developing innovative chemistries that go hand-in-hand with your cleaning process. The KYZEN PCS and solutions such as AQUANOX A4626 combine to create a worry-free process that just makes sense.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.