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KYZEN to Focus on Chemistry and Process Control at SMTA Oregon
May 15, 2023 | KyzenEstimated reading time: 1 minute
 
                                                                    KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Oregon Expo & Tech Forum, scheduled to take place Thursday, June 8, 2023 in Wilsonville, Oregon. The KYZEN team will spotlight the KYZEN Process Control System (PCS), the world’s first and only concentration monitoring and control system, in addition to the award-winning aqueous solutions AQUANOX A4625 and AQUANOX A4626.
The KYZEN PCS controls, monitors, and automatically reacts to the dynamic changes in the wash bath concentration. Since its introduction more than 20 years ago, the capabilities of the KYZEN PCS have continued to improve and advance in the mission of maximizing high-quality output from inline cleaning systems.
AQUANOX A4625 is a highly effective, dispersive cleaning agent with excellent material compatibility designed to clean electronic assemblies in spray-in-air cleaning equipment. It excels in low concentrations and temperatures with proven effectiveness on more than 90% of solder pastes currently in production with additional use in cleaning lead-free and no-clean flux types.
The environmentally-friendly AQUANOX A4626 is reliable with a long tank life and is designed to efficiently remove the latest polymeric no-clean flux residues. The multi-pass, application-safe aqueous spray also delivers excellent results on traditional lead-free and eutectic tin lead residues.
For over 30 years, KYZEN has been developing innovative chemistries that go hand-in-hand with your cleaning process. The KYZEN PCS and solutions such as AQUANOX A4626 combine to create a worry-free process that just makes sense.
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Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    