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Scienscope Heads to Canada for the First Time for EPTECH Vancouver
May 24, 2023 | Scienscope InternationalEstimated reading time: 1 minute
Scienscope International, a leading supplier of cabinet-style micro-focus X-ray systems in the United States, is excited to announce its first-ever appearance at a tradeshow in Canada. The company looks forward to discussing its array of innovative component solutions and advanced X-ray inspection systems at EPTECH Vancouver, scheduled for Wednesday, June 7, 2023. Scienscope will showcase its latest innovations at the event, including the AXC-800III X-ray component counter, IMS-100 (T) inventory management system, and the new Stencil Rack.
The new Smart Stencil Rack has been engineered to enhance the efficiency of storing and retrieving solder stencils. With a retrieval or storage time of a few seconds per stencil, this innovative system minimizes operators’ time locating the appropriate position for their stencil. The Smart Stencil Rack has been meticulously designed to accommodate stencil sizes from 23”x23” to 29”x29” with spacing to accommodate stencils with widths of 5mm, 20mm, and 40mm.
The AXC-800III is an award-winning device that utilizes AI algorithms and X-ray technology to count components inside reels with an accuracy rate of 99.9%. Additionally, the AXC-800III can upload results to a Manufacturing Execution System (MES) in real-time, generating new labels automatically as reels are removed from the machine, simplifying the labeling process, and ensuring accurate inventory management.
The IMS-100 (T) is a high-resolution barcode camera capable of reading and storing information for up to four 7", one 13", and one 15" reel. The system helps automate your incoming process and makes the relabeling process safe and easy, helping minimize human error.
With these cutting-edge solutions, Scienscope is dedicated to improving quality control and efficiency in the electronics manufacturing industry. Be sure to visit Scienscope at EPTECH Vancouver to learn more.
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Indium Experts to Deliver Technical Presentations at SMTA International
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.