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Electronics Manufacturers Reporting Cautious Optimism, Especially for Second Half of 2023
May 31, 2023 | IPCEstimated reading time: 1 minute
Per IPC’s May 2023 Global Sentiment of the Electronics Supply Chain Report, cost pressures continue to recede and demand remains positive for now, leading to a cautiously optimistic global electronics industry sentiment.
“Geopolitical factors, along with the continued impacts of inflation and rising nterest rates, have led manufacturers to describe the current economy as slow, uncertain, challenging, difficult, volatile, and unpredictable,” said Shawn DuBravac, IPC chief economist. “However, despite current conditions, the outlook for 2023 is relatively positive, with manufacturers expressing optimism and expecting growth, especially in the latter half of the year.”
Additional survey results indicate:
- The majority of respondents are still reporting that labor costs and material costs are rising, but the number of companies experiencing rising costs continues to decline. Only 49% of companies believe material costs will rise in the coming months, the first time this has fallen below 50 percent.
- Ease of recruiting skilled workers has also improved to its highest level since the survey began.
- The Orders Index slipped to 101. This is still in expansionary territory, but it is the lowest level seen since the start of the survey.
- Orders are expected to decline more so for firms operating in North America versus those in Europe, who instead are more likely expecting orders to remain stable.
For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain. View the full report.
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
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Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.