The Government Circuit: Three Inescapable Conclusions About Global Trade Policies
Global Citizenship: The Global Push for Digital Inclusion
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
TopLine to Present at NASA ETW June 13
June 5, 2023 | TopLineEstimated reading time: 1 minute
Martin Hart, CEO of TopLine Corporation, will deliver a presentation titled “Next Generation Solder Columns Extend Life for Large Packages for Space Applications and Data Centers” at the upcoming 14th Annual NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop (ETW) June 13. This annual Workshop returns to Building 3 Goett Auditorium at NASA Goddard Space Flight Center in Greenbelt, MD. Admission is free, with limited on-site access (first-come, first-served). WebEx remote attendance will be available to all.
Hart’s presentation compares the 40-year heritage of solder columns and their role in electronics packaging technology, with anticipated challenges to column technology demanded by increasingly larger packages and stress problems associated therewith. Hart looks at some of the exciting advances in columns and their potential to meet such challenges and extend component life for mission critical applications.
“Braided Solder Columns, comprised of an Indium core and Niobium exoskeleton exterior, are capable of operating in minus 150C to minus 270C environments,” Hart says. “This may enable the development of packages that can reliably operate at extremely cold temperatures for Quantum computing, for example, and for applications such as deployment on the back side of the moon.”
The Goddard Space Flight Center is a major NASA space research laboratory located approximately 6.5 miles northeast of Washington, D.C. in Greenbelt, Maryland, United States. Established in 1959 as NASA's first space flight center, GSFC employs approximately 10,000 civil servants and contractors.
Share on:
Suggested Items
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.