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June 5, 2023 | TopLineEstimated reading time: 1 minute
Martin Hart, CEO of TopLine Corporation, will deliver a presentation titled “Next Generation Solder Columns Extend Life for Large Packages for Space Applications and Data Centers” at the upcoming 14th Annual NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop (ETW) June 13. This annual Workshop returns to Building 3 Goett Auditorium at NASA Goddard Space Flight Center in Greenbelt, MD. Admission is free, with limited on-site access (first-come, first-served). WebEx remote attendance will be available to all.
Hart’s presentation compares the 40-year heritage of solder columns and their role in electronics packaging technology, with anticipated challenges to column technology demanded by increasingly larger packages and stress problems associated therewith. Hart looks at some of the exciting advances in columns and their potential to meet such challenges and extend component life for mission critical applications.
“Braided Solder Columns, comprised of an Indium core and Niobium exoskeleton exterior, are capable of operating in minus 150C to minus 270C environments,” Hart says. “This may enable the development of packages that can reliably operate at extremely cold temperatures for Quantum computing, for example, and for applications such as deployment on the back side of the moon.”
The Goddard Space Flight Center is a major NASA space research laboratory located approximately 6.5 miles northeast of Washington, D.C. in Greenbelt, Maryland, United States. Established in 1959 as NASA's first space flight center, GSFC employs approximately 10,000 civil servants and contractors.
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