Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
Rogers Corporation to Exhibit with John Coonrod Presenting at IMS 2023
June 8, 2023 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation's Technical Marketing Manager, John Coonrod, will give two presentations June 14th in the MicroApps Theater at the International Microwave Symposium (IMS) in San Diego, CA. Topics include “3D Printed RF Structures Open the Potential to Think Out of the Box” and “Thermal Stability Consistency is Even More Important at Millimeter-Wave Frequencies.”
In addition, Rogers will be showcasing its products in Booth #1635 during IMS, the world’s largest RF and Microwave show, which takes place from Tuesday, June 13 to Thursday, June 15. These products include Radix™ 3D Printable Dielectrics and new Anteo™ low loss laminates.
Rogers new family of Anteo laminates is designed to offer low loss RF performance as an alternative to FR-4 in commercial and consumer applications. With a dielectric constant of 4.07 +/- 0.08 and a dissipation factor of .005 at 10 GHz, Anteo laminates offer two benefits in comparison to thicker grades of FR-4. For a comparable price, it offers superior performance and enables greater antenna gain and efficiency. But the lower dissipation factor also enables similar or marginally improved performance at 1/3rd to ½ the thickness of FR-4, thus providing a significant cost savings and improvement in packaging.
Radix™ 3D Printable Dielectric, is the first 3D material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.
Rogers Corporation’s Radix3D Printable Dielectric is a proprietary composite material designed for Digital Light Processing (DLP) 3D printing, enabling a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. This printable dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
The material is intended for use as RF material in applications where new geometric freedom can enhance the figure of merits of an RF system, such as gradient dielectric constant (GRIN) structures and other complex three-dimensional parts. The Radix 3D Printable Dielectric offers the industry a way to manufacture systems and components at scale that could not be made with traditional fabrication methods. Radix materials are available directly from Rogers Corporation and our 3D printing partners. Learn more about Radix 3D Printable Dielectrics by visiting Rogers YouTube channel.
Share on:
Suggested Items
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Flexible Thinking: Flexible Circuit Technology—Looking Back and Forward
03/03/2025 | Joe Fjelstad -- Column: Flexible ThinkingFlexible circuit technology came on the scene as a solution largely for niche applications, however, the technology has emerged in recent years as a cornerstone of modern electronics. Today, the technology is enabling a broad range of new product designs across industries. From wearable devices and medical implants to foldable smartphones and numerous automotive applications, flexible circuits are arguably at the heart of much of the next generation of innovations.