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Martin Hart, CEO of TopLine Corporation, will deliver a presentation titled “Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous Packages” at IMAPS 2023 in San Diego, California, October 4, 2023.
“This paper describes our ongoing work to innovate non-collapsible, compliant Lead-Free Braided Copper Solder Columns to reduce strain caused by the Coefficient of Thermal Expansion (CTE) mismatch between large BGA packages and FR4 PCBs,” Hart states. “A braid, consisting of 16 fine copper alloy wires, serves as an exoskeleton sleeve around a solder column to provide mechanical support as well as compliancy. This novel solder column technology supports market trends to scale up the size of chip packaging for AI and Datacenters while maintaining reliability.”
Hart’s presentation compares the 40-year heritage of solder columns and their role in electronics packaging technology and looks at some of the exciting advances in columns and their potential to meet such challenges and extend component life for mission critical applications.
The 56th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held in San Diego, California . This year's Symposium will feature 5 technical tracks, plus an Interactive Poster Session.
