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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Cadence Completes Acquisition of PHY IP Assets from Rambus
September 8, 2023 | Cadence Design Systems, Inc.Estimated reading time: Less than a minute
Cadence Design Systems, Inc. announced that it has completed the previously announced acquisition of the SerDes and memory interface PHY IP business from Rambus Inc. With the continued proliferation of AI, data center and hyperscale applications, CPU architectures, and networking devices, the technology asset purchase enriches Cadence’s established IP portfolio and augments the company’s Intelligent System Design™ strategy, which drives design excellence. The acquisition also comes with the addition of experienced PHY engineering teams in the United States, India and Canada, further expanding Cadence’s domain-rich talent base.
Suggested Items
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Avnet Insights: Engineers Outline Opportunity for AI
12/19/2024 | AvnetFor the fourth consecutive year, Avnet, Inc. (Nasdaq: AVT) will release its Avnet Insights survey, which has been keeping a pulse on how engineers are responding to the market since 2021. This year’s survey examines technology’s new frontier: Artificial Intelligence, and the promise – and challenges – it presents for product design.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.