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Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
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Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
Advanced, Complex & Emerging Designs
This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
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Cadence Completes Acquisition of PHY IP Assets from RambusSeptember 8, 2023 | Cadence Design Systems, Inc.
Estimated reading time: Less than a minute
Cadence Design Systems, Inc. announced that it has completed the previously announced acquisition of the SerDes and memory interface PHY IP business from Rambus Inc. With the continued proliferation of AI, data center and hyperscale applications, CPU architectures, and networking devices, the technology asset purchase enriches Cadence’s established IP portfolio and augments the company’s Intelligent System Design™ strategy, which drives design excellence. The acquisition also comes with the addition of experienced PHY engineering teams in the United States, India and Canada, further expanding Cadence’s domain-rich talent base.
Cadence Design Systems, Inc. and CEVA, Inc. announced that Cadence has completed its acquisition of Intrinsix Corporation from CEVA.
Based on the wisdom of 50 years of PCB manufacturing at Sunstone Circuits, this book is a must-have reference for designers understanding the PCB manufacturing process as it relates to their design. Designing for manufacturability requires understanding the production process fundamentals and factors within the process that often lead to variations in manufacturability, reliability, and cost of the board.
This week’s must-reads cover a little bit of everything: advanced packaging substrates, rigid-flex design, the potential loss of tribal knowledge, ultra HDI processing, and the need for fabricators to begin utilizing Smart systems. In a few weeks, we’ll be attending SMTA International in Minneapolis, and then productronica in Munich. We hope to see you on the road!
Siemens, TSMC Collaborate to Help Mutual Customers Optimize Designs Using Foundry's Newest Advancements09/29/2023 | Siemens
Siemens Digital Industries Software announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple industry-leading Siemens EDA product lines for the foundry’s latest process technologies.
Cadence Design Systems, Inc. announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard.