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Aismalibar, Technosystem Showcase Next-Generation PCB Solutions at productronica 2025

11/05/2025 | Aismalibar
BENMAYOR S.A., parent company of Aismalibar and Technosystem, will present its latest innovations in thermal management materials and PCB automation systems at Productronica 2025, the world’s leading trade fair for electronics development and production.

Ventec to Exhibit Latest Materials and Machinery for Cutting-edge PCB Production at productronica 2025

11/05/2025 | Ventec International Group
Ventec International Group will present advanced materials at Productronica 2025 in Munich, ushering in the ‘Glass Free Revolution’ with the latest and pro-bond & thermal-bond bondply materials.

Target Condition: Distribution of Power—Denounce the Ounce

11/05/2025 | Kelly Dack -- Column: Target Condition
Have you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.

High Density Packaging User Group Announces ASKPCB Membership

11/03/2025 | HDP User Group
High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.

TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference

11/03/2025 | Globe Newswire
TTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
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