Ultra-flat, No-Profile ED Copper Foils for High-speed Digital PCBs

Estimated reading time: 1 minute

Abstract

Copper surface roughness has become a significant factor that influences conductor loss in high-speed PCBs, particularly for signals above the 10 GHz range. Surface roughness is also an important consideration for etching very narrow-pitch HDI applications.

A new type of ED copper foil achieves a very smooth surface. Specific ultra-flat, zinc-free, arsenic-free treatments with the highest density and uniformity are being applied on such topographies. This significant increase in active contact surface provides secure bond strength to a large number of proprietary low- and very low-loss resin systems. The reduction of the foil’s treatment profile has essential advantages, since insertion loss is improved, therefore allowing new opportunities in the antenna and high-speed digital arena.

Introduction

As our planet becomes more interconnected, the infrastructure needed to capture and work with increasing amounts of data must respond and deliver faster results to more users than ever before. Studies foresee that global data center traffic will increase four-fold over the next years and six-fold for global cloud traffic.

To cope with an increased demand for improved resin systems with better electrical properties, many new dielectrics have already been introduced to the market, and many others are at their final development stage.Read the full article here.Editor's Note: This article originally appeared in the March 2014 issue of The PCB Magazine.