- smt007 Magazine
In this issue, we (and AI) explored how and when artificial intelligence plays a role in manufacturing today. Whether on the factory floor, or in the front office, AI applications are emerging and changing how we approach planning, processes and problem solving.
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- smt007 Magazine
High-end Assembly Requirements for Precision DispensingMarch 18, 2015 | Real Time with...IPC
Estimated reading time: Less than a minute
Dispensing is the cost-effective solution for repeatably placing precise amounts of underfills, encapsulants and sealants in otherwise inaccessible areas as packaging complexity inceases, particularly in the third dimension. Brian Chung sees mobile and wearable electronics as the drivers of the leading edge of precision dispensing technology.
Watch the interview here.
Dixon wholly owned subsidiary- Padget Electronics Private Limited enters into an Agreement with Xiaomi to carry out manufacturing of smart phones and other related products for Xiaomi.
USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics09/29/2023 | USPAE
In a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is proud to announce that it is sponsoring the Women’s Leadership Program Connection Reception to be held at SMTA International.
The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
ZESTRON is happy to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting "Revolutionizing PCB Assembly Cleaning: