-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueTest and Inspection
Test and inspection methods are undergoing rapid change. In this issue, we consider the influence of AOI, AI, and human eyes. How exactly are these pieces of the puzzle changing the role of test and inspection?
Chips Don't Float
In Europe and the U.S., legislation is under way to revitalize PCB fabrication and packaging. What is the status of this work, and how specifically does this change the industry landscape for EMS companies? What will help keep us afloat?
Flying High With Digital Twin
The opportunity to use manufacturing simulation as a test bed for job planning and process optimization brings continuous improvement into the modern age. This may be an all-or-nothing type of project, but it’s worth the investment.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
The Importance of Solder Process Expertise
April 2, 2015 | Real Time with...IPCEstimated reading time: Less than a minute

Alpha's Marketing Manager for the Americas Robert Wallace talks about new products such as solder preforms shaped like passive components and low temp solder alloy pastes.
Suggested Items
Indium Acquires SAFI-Tech to Advance Low-Temperature Soldering Technology
10/03/2023 | Indium CorporationIndium Corporation, an international electronics materials refiner, smelter, manufacturer, and supplier, is proud to announce the acquisition of SAFI-Tech, a metal microcapsule technology innovator specializing in supercooling technology.
Indium’s Wisdom Qu to Present at iNEMI Workshop on Automotive Electronics
10/02/2023 | Indium CorporationIndium Corporation Regional Product Manager Wisdom Qu will present at the iNEMI Workshop on Automotive Electronics on October 13, in Shenzhen, China.
Indium’s Wisdom Qu to Present at SMTA China South Technical Conference
09/29/2023 | Indium CorporationIndium Corporation Regional Product Manager Wisdom Qu will present at the SMTA China South Technical Conference, held in conjunction with NEPCON Asia, on October 11 in Shenzhen, China.
The End of Solder?
09/28/2023 | Nolan Johnson, I-Connect007The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
Nihon Superior’s Mr. Keith Sweatman to Present at the 2023 SMTA International Technical Conference
09/27/2023 | Nihon Superior Co. Ltd.Nihon Superior Co. Ltd. is pleased to announce that Keith Sweatman, the company's Senior Technical Advisor, will deliver a presentation titled "A Path to Ductile Low-Temperature Solders for Mass Production of Electronic Assemblies" at the upcoming SMTA International conference and exposition.