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In this issue, we (and AI) explored how and when artificial intelligence plays a role in manufacturing today. Whether on the factory floor, or in the front office, AI applications are emerging and changing how we approach planning, processes and problem solving.
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Software and Hardware SolutionsApril 24, 2015 | Real Time with...IPC
Estimated reading time: Less than a minute
Jim Dickerson discusses software that goes beyond the SMT line to manage the whole process flow of the factory. Shawn Robinson describes award-winning placement systems with multi-recognition camera technology.
Watch the interview here.
Technica USA announced it has reached a Master Distribution Agreement with SAA to promote and support automation systems & technology offered by SAA.
Lockheed Martin Skunk Works, in partnership with the U.S. Air Force, completed the first flight of the U-2 Dragon Lady's Avionics Tech Refresh (ATR) program.
Macronix International Co., Ltd., a leading integrated-device manufacturer in the non-volatile memory (NVM) market, announced its OctaFlash memory line has received ISO 26262 ASIL D (Automotive Safety Integrity Level) certification from SGS TÜV Saar, ensuring makers of automotive electronic systems that OctaFlash meets the highest level of safety in automotive electronics.
"Electronics systems are at the heart of almost all modern technology. The performance and functionality of these systems have increased at breathtaking speed, chiefly as a result of advancements in semiconductor technology. Semiconductors do not function in isolation," writes Alison James, IPC senior director of government relations, in a 2023 report for the European Commission’s Directorate General for Internal Market, Industry, Entrepreneurship. "These electronics systems feature prominently in key sectors like defence, aerospace, space, automotive, medical, and high-performance computing, but electronics are vital to every industry and are central to a variety of EU priorities, including the twin digital and green transitions and Europe’s technological sovereignty."
In a previous column, the critical process of desmear and its necessity to ensure a clean copper surface connection was presented. Now, my discussion will focus on obtaining a void-free and tightly adherent copper plating deposit on these surfaces. After the desmear process, the task is to insure a continuous, conductive, and void-free deposit on the via walls and capture pad. Today, there are several processes that can be utilized to render vias conductive.