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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/21/2025 | Michelle Te, I-Connect007
Were you one of the lucky ones who made it to Europe’s largest electronics trade show this week? By all accounts, this massive event was buzzing with new technologies, packed booths, and plenty of tired feet by the end of each day. So, if you’re heading home from productronica (or, like me, just enjoying the end of a busy week), now’s the perfect time to unwind a bit. Settle into that airplane seat (or office chair), grab a snack, and catch up on some great reads from I-Connect007.

Marcy’s Musings: Thank You, Columnists!

11/18/2025 | Marcy LaRont -- Column: Marcy's Musings
This month, we’re showing our gratitude for our PCB007 columnists. These individuals are dynamic, intelligent, vibrant, and fun people who share their expertise every month on topics ranging from chemical processes to masterful marketing. In this issue, you’ll get to know them on a more personal level, learning what drives them, and discovering how their stories have shaped them into the professionals who help us all do our jobs better.

American Made Advocacy: National Security and Industrial Policy Inextricably Linked

11/18/2025 | Shane Whiteside -- Column: American Made Advocacy
Every year, the Pentagon publishes a national security strategy. The newest version is in its final stages of development. It is said to indicate China remains a top priority for deterrence, but there is a renewed emphasis on the homeland and the Western Hemisphere.

Chapters in Action: The Electronics Foundation Helps Students Connect, Learn, and Lead

11/18/2025 | Charlene Gunter du Plessis, The Electronics Foundation
The Electronics Foundation (formerly IPC Education Foundation), part of the Global Electronics Association, is focused on preparing U.S. students for careers in the electronics industry by fostering collaborations through student chapters. Here, we feature five initiatives that are cultivating a new generation of talent ready to meet the challenges and innovations of modern manufacturing.

Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025

11/17/2025 | Sydney Xiao, Global Electronics Association East Asia
Discussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.
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