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Valtronic Features Newest Connectivity Platform at IMAPS
June 5, 2015 | ValtronicEstimated reading time: 1 minute
Valtronic, contract manufacturer of miniaturized electronic products for trusted medical device partners, announces that it will attend IMAPS’ advanced technology workshop on Electronic Packaging for Wearable Electronics, scheduled to take place at the Doubletree Suites in Austin, TX from June 15-16, 2015. For more information about the show, click here.
Valtronic team members will highlight Compendium Solutions, which is a secure implant and physiological connectivity platform that focuses miniaturization of electronics due to the small nature of today’s wearable devices. The platform provides an integrated system including Valtronic-owned IP and even a proprietary phone app, creating opportunities to build greater value with customers. Compendium Solutions provides data transfer to the dashboard of a near-field reader, tablet and Cloud, and even direct to a physician dashboard.
Recent technological advancements and innovations in the field of wearable Web-enabled medical devices have resulted in Valtronic looking to the future with an exciting new vision in mind: “To be the worldwide recognized partner for innovative personal wearable healthcare devices.” To pursue this vision, Valtronic is committed to bringing innovative ideas and technological expertise to one platform to guide customers and healthcare providers to delivering improved patient care and outcomes.
To learn more about Compendium’s breakthrough technology and Valtronic’s wide variety of miniaturized electronics, click here or visit www.valtronic.com.
About Valtronic
We innovate and manufacture miniaturized electronic products for our trusted medical device partners. We produce integrated electronic and mechanical products. Our customers are leading global suppliers of medical implants and devices, diagnostic imaging equipment and sensitive aerospace and industrial assemblies. For over 30 years we have helped hundreds of companies develop and produce Class II & III medical devices and advanced miniaturized electronic assemblies.
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