-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueFinding Ultra
New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. Is it time to start paying close attention to this convergence?
Developing a Strategy
A solid strategy is a critical part of success. This month, we asked some of the top industry leaders and business strategy “gurus” to share their thoughts on developing strategies.
Winning With TQM
In this issue, we explore how TQM has entered the DNA of continuous improvement disciplines, and the role leadership transformation plays in this. If you've ever competed against a TQM company, you understand their winning advantage.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
EIPC Summer Conference Just Around the Corner
June 9, 2015 | EIPCEstimated reading time: Less than a minute
It's less than two weeks away before the European Institute of Printed Circuits (EIPC) Summer Conference. To be held in Berlin from June 18 to 19, this year's event will include a guided tour of the Fraunhofer Institute.
The conference will have an iconic selection of speakers, including Alun Morgan, EIPC Chairman, who will present a market outlook on behalf of Walt Custer who is unable to join this year, as well as luminaries as Dr. Ivan Ndip, Lars Böttcher and Dr. Olaf Wittler, all from Fraunhofer IZM. Walter Huck of IEC and Martyn Gaudion of Polar Instruments will also be present, so as speakers from AT&S, Thales, Cimulec, Atotech, Taiyo, Camtek, First EIE, Du Pont and Cambridge Nanotherm, to name a few.
Download the conference registration form by clicking here.
For the detailed conference programme, click here.
Suggested Items
DuPont Leaders to Discuss Sustainability and Innovation in Semiconductor Materials at Strategic Materials Conference
09/29/2023 | DuPontDuPont announced that Randal (Randy) King, PhD, Vice President of R&D, DuPont Electronics & Industrial, and Scott Collick, Vice President, Sustainability, will deliver presentations on sustainability and innovation in the semiconductor industry at the SEMI Strategic Materials Conference.
SMTAI Conference Schedule at a Glance
09/06/2023 | SMTASMTA International provides your best chance to reconnect with the global electronics manufacturing community and to stay competitive, identify challenges, innovate and exceed expectations. We invite you to attend this year's SMTA International Conference and Exhibition, Oct. 9–12, at the Minneapolis Convention Center in Minnesota. We are proud of our legacy of providing outstanding networking and learning experiences and this year will be no different. The conference and exhibition are a unique opportunity for us to connect, discover, and learn from each other and industry experts.
An Invitation from SMTA President Martin Anselm
09/06/2023 | Martin Anselm, SMTAAs the current president of SMTA, I’d like to extend an invitation to everyone in the electronics manufacturing industry to join us Oct. 9–12, 2023 at the Minneapolis Convention Center in in Minnesota for our flagship event—SMTA International Conference and Exposition. This event is once again co-located with MD&M Minneapolis, providing an intriguing mix of related manufacturing technology cross-over among the respective shows.
AGC Multi Material America to Participate in PCB West Exhibition
08/31/2023 | AGC Multi Material AmericaAGC Multi Material America is participating in the PCB West Exhibition in Santa Clara, California on September 20, 2023.
Gen3 to Exhibit at the 24th European Microelectronics & Packaging Conference
08/29/2023 | Gen3Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimization equipment, is excited to announce its participation at the 24th European Microelectronics & Packaging Conference (EMPC) taking place Sept. 11-14, 2023 at the Wellcome Genome Campus, Hinxton, near Cambridge, UK.