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Advanced Electronics Packaging Digest

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Tata Electronics, Enomoto Sign MoU to Strengthen India Semiconductor Packaging

09/24/2026 | Tata Electronics
Tata Electronics, a pioneering leader in India’s electronics and semiconductor manufacturing sector, and Enomoto Co., Ltd., a leading Japanese precision semiconductor component manufacturer, have signed a Memorandum of Understanding (MoU) to advance the semiconductor packaging ecosystem in India, and support Tata Electronics’ packaging facility in Jagiroad, Assam. 

SMART Photonics, GlobalFoundries Partner on Open-Access Silicon-Photonics Foundry Service

09/24/2026 | GlobalFoundries
SMART Photonics B.V. announced its partnership with GlobalFoundries (GF) to offer a new open access foundry service combining GF’s scalable and production-proven silicon platform with SMART Photonics’ high-volume indium phosphide photonic integrated circuits (PICs), including lasers and modulators.

Merlin Flex Continues to Invest in Long Flex

09/24/2026 | Merlin Flex Ltd
Merlin Flex Ltd has continued its investment into the manufacture of its long flex capability with a new oil-heated vacuum lamination press with a bonding area of 1800mm by 750mm.

Lyntris Qualifies SPY-6 Radar Assembly for Naval Supply Chain

09/24/2026 | PRNewswire
Lyntris Inc., a defense technology company delivering sense-to-act connectivity solutions for the modern, connected battlespace, announced that it has completed qualification of a critical hardware assembly supporting Raytheon's SPY-6 family of radars.

Qualitel Acquires Fusion EMS

09/24/2026 | Qualitel
Qualitel Corporation is pleased to announce the acquisition of Fusion EMS, an electronics manufacturing services provider based in Hillsboro, Oregon.
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