American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
It’s Only Common Sense: Selling Without Selling
IEC Enters Sales and Service Partnership with Tritek
July 22, 2015 | IECEstimated reading time: 1 minute
IEC is pleased to announce the addition of Tritek Circuit Products (Tritek) as Sales Agents to IEC’s North American customers. Tritek will provide sales and service to customers in the Southern California and Texas markets.
Tritek Circuit Products was established in 1991 as a full service distributor to the printed circuit fabrication industry and provides a full complement of products and services. The Tritek Sales/Service team has a broad range of expertise with 125+ years of industry experience.
About International Electronic Components Inc.
International Electronic Components Inc. (IEC) is a leading sales and service provider of consumables used in the North American printed circuit board market and will celebrate 50 successful years in 2016. IEC USA was founded by Shawn Stone and Chuck Williams in 1998. Key products include chemistry, dry films, copper clad laminates, prepreg materials and machinery. With conversion and warehousing facilities in Santa Clara, Chicago and Toronto, IEC is positioned to service the time critical requirements of the North American PCB industry.
About ITEQ
ITEQ is a leading manufacturer of copper clad laminate globally and is based in Taiwan. ITEQ stands for innovation, teamwork, excellence and quality, and has been in business since 1997, with five manufacturing sites based in Taiwan and China. The IEC- ITEQ partnership will enable North American PCB suppliers to receive leading edge supply chain capabilities for copper clad laminate and prepreg.
For more information about IEC please contact Shawn Stone, President.
Telephone: 416-293-2961 Email: shawn.stone@ieccan.com.
For more information about ITEQ please contact Mark Shields
Telephone: 614-937-5205 Email: mshields@iteq.com.tw
For more information about Tritek please contact Bill Seles
Telephone: 714-279-1060 Email: bseles@tritekcp.com
Share on:
Suggested Items
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.