-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Fast Interconnect Announces Multi-Platform Design Services
September 2, 2015 | Fast InterconnectEstimated reading time: 1 minute
Fast Interconnect is now offering its customers a choice of CAD software platforms. According to co-founder Gary Griffin, “One large benefit of coming to Fast Interconnect is that fact that we can design your product in your existing CAD software package. Many companies that ask for design updates find it hard to find a company to assist them that can use the software they have established as their core software design suite.”
This provides immediate advantages for PCB designers.
“Keeping the design in the software currently being used enables the customer to have a useable database in their archive that their engineers are comfortable with. This also means that for future updates the customer is not forced to remember what package was used and where it was done,” Griffin continued. “This provides a freedom from being forced to go with a different design package simply because you are in a hurry and don’t feel you have a choice. We provide that freedom of choice.”
The available CAD packages are Mentor Graphics PADS/Xpedition®/xDX Designer, Cadence Allegro®, Zuken CADSTAR, Altium, P-CAD and Protel. Schematic capture packages for all of the aforementioned, as well as Cadence OrCAD.
As a value-added service, Fast Interconnect performs a full CAM preview of the Gerber files before they are released to the customer. This ensures there are no issues that were not evident during the design review.
For more information, visit www.fastinterconnect.com.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
What Emerging Circularity Policies Mean for the Electronics Industry
11/20/2025 | I-Connect007 Editorial TeamAs Europe accelerates toward a circular economy, electronics manufacturers face a wave of new sustainability requirements that will redefine product design, materials management, and end-of-life strategies. During a Nov. 11 webinar co-hosted by the Global Electronics Association and the Anthesis Group, industry leaders outlined the regulatory landscape shaping the next decade, including the Eco-design for Sustainable Products Regulation (ESPR), the Right to Repair (R2R) Directive, and the Extended Producer Responsibility (EPR) regulatory framework.
TTCI Receives 2025 Global Technology Award for Redefining Design for Testability in High-Reliability Electronics
11/20/2025 | TTCIThe Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, has been awarded the 2025 Global Technology Award in the Test Services category for its groundbreaking work in Design for Testability (DFT).
Rubin’s Cableless Architecture and ASIC High-Layer HDI Designs Push PCBs to the Center of AI Compute Power
11/20/2025 | TrendForceTrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance.
Accelerating the Global Commercialization of AR Waveguide Technology with AAC Technologies
11/19/2025 | Globe NewswireAAC Technologies Pte. Ltd., a world-leading smart device solution provider and a company incorporated in Singapore and a fully-owned subsidiary of AAC Technologies Holdings Inc., whose shares are listed and traded on the Hong Kong Stock Exchange, has signed a definitive agreement to acquire the shares and other equity securities in Dispelix Oy, a technology leader in diffractive waveguide displays for augmented reality (AR).
Flexible Circuit Technologies Welcomes Senior Applications Engineer Zack Schaner
11/18/2025 | Flexible Circuit TechnologiesFlexible Circuit Technologies a Minnesota-based flexible circuit and advanced electronics contract manufacturer, welcomes Zack Schaner as Senior Applications Engineer.