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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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CPO Optical-Electrical Testing Drives Test Equipment Supply Chain Shift

10/13/2026 | TrendForce
TrendForce’s latest research on AI interconnect technologies reveals that growing demand for high-speed transmission in AI data centers is accelerating the transition of co-packaged optics (CPO) toward mass production, making shorter test times and lower costs increasingly important.

From Legacy to Next-Generation PCBAs: Zero-Defect Testing in Aerospace and Defense Electronics

10/13/2026 | Francesca Pinto, SPEA
In the aerospace and defense industry, a PCB assembly is never just a collection of components soldered onto a substrate. It is a working part of a much larger mission system responsible for flight control, navigation, communication, power distribution, surveillance, or targeting. Whether it sits inside a civil aircraft, an autonomous drone, a compact satellite, an advanced radar unit, or a military ground vehicle, that assembly is expected to perform without fail throughout its service life, often measured in decades.

Trio-Tech Secures $4.45M Burn-In Equipment Contract

10/08/2026 | BUSINESS WIRE
Trio-Tech International, a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has secured a new three-year contract valued at approximately $4.45 million to provide burn-in testing equipment and ongoing technical and maintenance support to an existing European automotive semiconductor customer.

Teradyne Introduces Titan HP Platform for AI Data Center Devices

10/06/2026 | BUSINESS WIRE
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced a production-ready system that delivers enhanced burn-in capabilities on its Titan™ HP platform.

UL Solutions Completes Acquisition of Eurofins Scientific’s Electrical & Electronics Business

10/02/2026 | BUSINESS WIRE
UL Solutions Inc., a global leader in applied safety science, announced it has completed the acquisition of the electrical and electronics (E&E) business of Eurofins Scientific SE.
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