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TUC Found to Infringe Isola PatentsSeptember 24, 2015 | Isola
Estimated reading time: 1 minute
Isola Group announced today that a jury in the U.S. District Court for District of Arizona found that Taiwan Union Technology Corporation (TUC) had directly and indirectly infringed key patents held by its U.S.-based subsidiary, ISOLA USA Corp. The products found to infringe were TUC’s TU-872 laminate and prepreg products. The jury also unanimously found that Isola’s patents were valid and that TUC’s infringement was willful.
Pursuant to the verdict, the jury awarded Isola damages of $11.5 million for lost profits and reasonable royalty damages. The jury’s unanimous finding of willful infringement also means the Court has discretion to treble the damages awarded to Isola, and to award attorney’s fees and costs to the company.
“We are extremely pleased with the jury’s verdict,” stated Jeff McCreary, Isola’s President and CEO. “The jury’s verdict is the culmination of more than three years of litigation by Isola. It reaffirms the strength of our patents and the company’s commitment to protecting and defending our intellectual property.”
The Isola patents at issue in the case were United States Patent Nos. 6,509,414 (“Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Co-Crosslinking Agent”) and 8,022,140 (“Copolymer of Styrene and Maleic Anhydride Comprising an Epoxy Resin Composition and A Co-Cross-Linking Agent”).
Isola Group, headquartered in Chandler, Arizona, is a global material sciences company focused on designing, developing, manufacturing, and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multi-layer printed circuit boards. The company’s high-performance materials are used in sophisticated electronic applications in the communications infrastructure, computing/networking, military, medical, aerospace and automotive industries. For more information, visit our website at http://www.isola-group.com/.
The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.