Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
TUC Found to Infringe Isola Patents
September 24, 2015 | IsolaEstimated reading time: 1 minute
Isola Group announced today that a jury in the U.S. District Court for District of Arizona found that Taiwan Union Technology Corporation (TUC) had directly and indirectly infringed key patents held by its U.S.-based subsidiary, ISOLA USA Corp. The products found to infringe were TUC’s TU-872 laminate and prepreg products. The jury also unanimously found that Isola’s patents were valid and that TUC’s infringement was willful.
Pursuant to the verdict, the jury awarded Isola damages of $11.5 million for lost profits and reasonable royalty damages. The jury’s unanimous finding of willful infringement also means the Court has discretion to treble the damages awarded to Isola, and to award attorney’s fees and costs to the company.
“We are extremely pleased with the jury’s verdict,” stated Jeff McCreary, Isola’s President and CEO. “The jury’s verdict is the culmination of more than three years of litigation by Isola. It reaffirms the strength of our patents and the company’s commitment to protecting and defending our intellectual property.”
The Isola patents at issue in the case were United States Patent Nos. 6,509,414 (“Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Co-Crosslinking Agent”) and 8,022,140 (“Copolymer of Styrene and Maleic Anhydride Comprising an Epoxy Resin Composition and A Co-Cross-Linking Agent”).
About Isola
Isola Group, headquartered in Chandler, Arizona, is a global material sciences company focused on designing, developing, manufacturing, and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multi-layer printed circuit boards. The company’s high-performance materials are used in sophisticated electronic applications in the communications infrastructure, computing/networking, military, medical, aerospace and automotive industries. For more information, visit our website at http://www.isola-group.com/.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.