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From June 10–12, 2026, Henger Microelectronics made a powerful appearance at the JPCA SHOW in Tokyo — one of the world’s most influential exhibitions for the electronic circuit and advanced packaging industries.

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Cleanliness is a critical factor in the production of every electronic component, from wafer fabrication to final product assembly. Unclean surfaces and parts can ruin entire batches of products, negatively affecting product performance, production yield rates, and overall operational costs. Any lapse in production quality or excessive downtime can be detrimental to an electronics manufacturing facility.

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SMT007 Magazine June Issue Focuses on Cleaning, Contamination Control, and Reliability

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SMT007 Magazine’s June issue examines how cleaning processes, contamination control, and reliability engineering are evolving to support highly dense assemblies, advanced packaging, and next-generation electronics manufacturing.
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