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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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BTU Talks Challenges and Trends Driving Product Development Strategies
October 8, 2015 | Real Time With... NEPCON South ChinaEstimated reading time: Less than a minute
Coco Zhang, product manager at BTU Ltd, discusses with I-Connect007's Stephen Las Marias some of the technology trends and customer challenges and requirements that are driving innovations in their reflow ovens. She talks about energy efficiency, the challenges of complex boards used in the telecom industry as well as in servers, and the requirements from the semiconductor packaging industry.
Zhang also highlights some of the strategies they are doing to stay ahead of their competition.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 3
08/14/2024 | I-Connect007 Editorial TeamChapter 3 of this book delves into the critical aspects of the SMT process, focusing on the reflow oven and automated optical inspection (AOI) machine. Highlighted are the key roles of the line operator, manufacturing engineer, and quality manager in maintaining efficient operations and high-quality PCBAs.
Solderstar to Present Advanced Reflow Profiling Solution at SMTA International 2024
08/08/2024 | SolderStarSolderstar, a leader in innovative profiling solutions for the electronics manufacturing industry, is exhibiting at the SMTA International 2024 conference in Rosemont, Illinois, booth 2838, from October 22-24.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/26/2024 | Nolan Johnson, I-Connect007This week, I’ve been attending Thailand Electronic Circuits Asia 2024. This is the inaugural event, hosted by Thailand Printed Circuit Association (THPCA) in collaboration with the Hong Kong Printed Circuit Association (HKPCA). Thailand has supported a PCB industry for some time—mostly automotive applications—but the China Plus One dynamic has definitely taken root here.
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
07/19/2024 | AlltematedAlltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Indium Corporation’s New Type 6 Jetting Solder Paste Hits Market
06/26/2024 | Indium CorporationIndium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.