Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 3

08/14/2024 | I-Connect007 Editorial Team
Chapter 3 of this book delves into the critical aspects of the SMT process, focusing on the reflow oven and automated optical inspection (AOI) machine. Highlighted are the key roles of the line operator, manufacturing engineer, and quality manager in maintaining efficient operations and high-quality PCBAs.

Solderstar to Present Advanced Reflow Profiling Solution at SMTA International 2024

08/08/2024 | SolderStar
Solderstar, a leader in innovative profiling solutions for the electronics manufacturing industry, is exhibiting at the SMTA International 2024 conference in Rosemont, Illinois, booth 2838, from October 22-24.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/26/2024 | Nolan Johnson, I-Connect007
This week, I’ve been attending Thailand Electronic Circuits Asia 2024. This is the inaugural event, hosted by Thailand Printed Circuit Association (THPCA) in collaboration with the Hong Kong Printed Circuit Association (HKPCA). Thailand has supported a PCB industry for some time—mostly automotive applications—but the China Plus One dynamic has definitely taken root here.

New Breakthrough in Double-Sided Reflow Part Retention from Alltemated

07/19/2024 | Alltemated
Alltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.

Indium Corporation’s New Type 6 Jetting Solder Paste Hits Market

06/26/2024 | Indium Corporation
Indium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in