-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
Simulation, Analysis, and AI
Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
Advanced, Complex & Emerging Designs
This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Sign up Now for DesignCon Early Bird Pricing
October 14, 2015 | DesignConEstimated reading time: Less than a minute

DesignCon helps you advance your career, learn from your peers, and grow your knowledge with in-depth technical training covering all aspects of electronic design, from chips through boards and systems. Sessions focus on technology that’s critical to your career: signal and power integrity, test and measurement, PCB design tools, and much more.
With the DesignCon 2016 Schedule Builder you can browse sessions, learn more about speakers, and construct your customized road map through this year's exciting lineup. Start building your schedule now.
DesignCon 2016 takes place January 19-21, 2016, at the Santa Clara Convention Center in Santa Clara, California. To register, click here.
Suggested Items
TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
09/28/2023 | TSMCTSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum.
Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design for TSMC
09/28/2023 | Keysight Technologies, Inc.Keysight Technologies, Inc., Synopsys, Inc., and Ansys announced a new reference flow for the TSMC N4PRF, the world's leading semiconductor foundry's advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
Rigid-flex Design Guidelines
09/27/2023 | Cherie Litson, CID+, Litson1 ConsultingRigid-flex circuits are unique structures; part rigid board and part flex, they’re increasingly working their way into many of the electronic devices we use every day. There have been many advances in rigid-flex lately as more companies find themselves exploring this technology. So, before I started writing this article about rigid-flex design, I double-checked a few things. Fortunately, there is plenty of rigid-flex information available on a variety of great websites that we all know and trust.
Three Things to Improve High-Speed PCB Signoff, Part 2
09/27/2023 | Brad Griffin, Cadence Design SystemsAnother challenge for SerDes is losses within the channel design. At high speeds, dielectric material can be very lossy, making the appropriate selection of the right material, length, etc., critical for the channel. Many questions about stackup, trace widths, and height from the ground plane need to be defined up front. Simulating a signal with a topology explorer tool extracted from the design can be used to set up and run sweep parameters and push min/max length/spacing values into the Allegro schematic constraint manager (system capture).
Keysight EDA 2024 Integrated Software Tools Shift Left Design Cycles to Increase Engineering Productivity
09/27/2023 | Keysight Technologies, Inc.Keysight Technologies, Inc. introduces Keysight EDA 2024, a tightly integrated suite of electronic design automation (EDA) software tools that ensures first pass success.