-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Sign up for Mentor’s Oct. 22 Library and Component Management Webinar
October 21, 2015 | Mentor GraphicsEstimated reading time: Less than a minute
The PCB is central to systems development, and the quality of your component libraries can have a dramatic impact on product performance, cost and quality. In a survey of the design community, when asked what were the key technologies required to improve their PCB Data Management, the two top items were:
- Centralized Library Management: 91%
- Component Management: 83%
Are you experiencing any of the following challenges?
- Engineers can’t find information on current parts
- No history tracking: who made what change, when, and why
- No process to prevent engineers from using parts that are undesirable or obsolete
- No process to ensure consistency and accuracy of part data
- Inaccurate component data causing BOM issues in manufacturing
- New parts are holding up the design process
If so, please attend the Library and Component Management Webinar at 10 am Eastern on October 22, 2015.
What you Will Learn:
- Component library structure for the Netlist and Integrated Flows
- Suggestions for configuring component libraries efficiently
- How to get started with a new component library
- How xDX DataBook can help you manage component parametric data
- Using tools for updating and maintaining current component data
Click here for more information, or to register.
Suggested Items
Polar Brings New Book 'The PCB Designers Guide to... More Secrets of High Speed PCBs' to EIPC Edinburgh
05/27/2025 | Polar InstrumentsPolar's latest book, The PCB Designer's Guide to... More Secrets of High Speed PCBs, will see its European Launch at the EIPC conference in Edinburgh, June 3-4, 2025. More Secrets unveils more of the knowledge that is often missed from theoretical text books to help both new and experienced designers realize the PCBs they “thought” they had designed.
FastlinkPCB Accelerates Global Expansion, Builds Efficient PCB Industry Chain
05/26/2025 | FastlinkPCBFastlinkPCB, a PCB manufacturing and assembly solutions provider, announced that it has completed the layout of subsidiaries in the US, Germany, Switzerland, and Malaysia over the past year, forming a localized service network covering North America, Europe, and Southeast Asia.
Defining the Ideal PCB Design Data Output
05/27/2025 | Stephen V. Chavez, Siemens EDAAt the heart of delivering successful, manufacturable printed circuit boards lies a vital question: What should your design data output package include to best support manufacturing? The answer: It depends. There are many factors to consider regarding the specific category you’re designing for—such as mil/aero, space, medical, and commercial. Other factors that need to be considered are requirements and engineering intent.
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForceTrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.