Target Condition: Distribution of Power—Denounce the Ounce
Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
Designers Notebook: Power and Ground Distribution Basics
Zuken Innovation World 2016 Submission Deadline Draws Near
December 2, 2015 | ZukenEstimated reading time: Less than a minute
Time’s running out to submit your presentation for Zuken Innovation World 2016, to be held April 18-20, 2016 in San Diego. This year's theme is Zuken University, with a shift toward classroom-style interactive sessions with smaller audiences. A session can range from design tutorials to emerging trends. Please submit your session topic today, before time runs out.
Call for Presentations Guidelines
• The deadline for final submission is December 11, 2015.
• Zuken users, partners, technologists and invited guests may submit a proposal for a presentation at Zuken Innovation World 2016. You may present more than one presentation, however, you must submit a separate proposal for each.
• Presentations are 30 minutes in length.
• A submission requires a Presentation title (10 words or less) and Presentation summary (150 words)
• Summaries should contain enough detail to clearly convey the material to be covered during the presentation. Be sure to include information about what attendees should expect to gain by attending.
• Government and company clearance to present and publish should be final at the time of submission.
• Summaries and biographies may be edited for the printed program to accommodate length requirements or to improve readability.
To submit your presentation, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Nortech Systems Incorporated Earns AS9100 Certification for Monterrey, Mexico Facility
11/04/2025 | BUSINESS WIRENortech Systems, Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, announced that its Monterrey, Mexico, facility has achieved AS9100:D certification.
On the Line With… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.