-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueDon’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
December 7, 2015 | IPCEstimated reading time: 4 minutes
![](https://iconnect007.com/application/files/7616/3116/0948/IPC_Logo-200.jpg)
Packaged Electronic Components
The B-11 3-D Electronic Packages Subcommittee continued work on IPC-7091, Design and Assembly Process Implementation of 3-D Components. There has been significant interest in this standard from both the military and commercial markets, and the subcommittee is ensuring groups doing similar work are included in the efforts for IPC-7091.
Flexible Circuits
The D-11 Flexible Circuits Design Subcommittee met to advance the Working Draft to IPC-2223D, Sectional Design Standard for Flexible Printed Boards. The group reviewed and approved new drawings depicting flexible cross-sectional construction examples and unbonded flex cross-sectional constructions for rigid-flex designs. The group also reviewed new content addressing the factors that affect impedance and capacitance control for flex and rigid-flex printed board applications so as to mitigate signal integrity issues.
The D-12 Flexible Circuits Performance Subcommittee met to advance the Working Draft to IPC-6013D, Qualification and Performance Specification for Flexible Printed Boards. The group also reviewed a cross-sectional illustrations that address voiding or delamination in the transition zone between flexible material and rigid material. The group also reviewed examples of anomalies in flexible printed board assemblies (e.g. kinks in the ribbon cable following assembly operations) and agreed to submit recommendations to the IPC 7-31b task group for addressing these issues in a future revision to IPC-A-610, Acceptability of Electronic Assemblies.
The D-13 Flexible Circuits Base Materials Subcommittee began review and updating of IPC-4202A to ultimately revise it to B revision.
The D-15 Flexible Circuits Test Methods Subcommittee began to review all flexible circuits test methods for relevance to all materials, printed boards and design standards. Most if not all test methods that apply to old flexible circuits (those that begin with “FC” are likely to be obsolete and will likely be archived.
Page 1 of 3
Suggested Items
Looking For That Perfect Job? Check Out jobCONNECT007
07/25/2024 | I-Connect007 Editorial TeamThere are a lot of open positions in this industry today. But where do you begin to look? We have the answer: jobCONNECT007, your guide to career opportunities in the electronic industry. In jobCONNECT007, you’ll find job openings that span the entire circuit board supply chain. Whether you’re involved in design, fabrication, assembly, test, or material development or distribution, this handy resource can help you get on your way to a new gig.
Strip Etch Strip: Episode 9 of On the Line With... Designing for Reality Podcast Now Available
07/25/2024 | I-Connect007Don't miss the latest episode of "On the Line With... Designing for Reality," where we walk through the PCB manufacturing process. At this stage, we have a panel made up of all the internal layers laminated together, through-holes drilled, and the outer layer copper features covered with a protective layer of tin.
Ventec Giga Solutions & Hi-Print Team up to Launch World's First 3-Color Inkjet Printing Solution
07/24/2024 | Ventec International GroupVentec Giga Solutions, Ventec’s value-added PCB equipment division, and leading inkjet printer manufacturer Hi-Print have teamed up to launch the industry’s most cutting-edge inkjet printer for solder mask technology.
Ian Walsh Appointed as Sondrel’s Regional VP for America
07/23/2024 | SondrellSondrel, a leading provider of ultra-complex, custom chips for leading global technology brands, has appointed Ian Walsh as its Regional VP for America, with the responsibility of growing Sondrel’s US semiconductor business from its new Silicon Valley offices in Santa Clara, CA.
LG Accelerates Smart Factory Solutions Business Integrating AI with 66-year Manufacturing Expertise
07/23/2024 | LGLG Electronics is advancing its smart factory solutions business by integrating artificial intelligence (AI) and digital transformation (DX) with its extensive 66-year history of manufacturing and production expertise.