DISA Awards Harris Corporation Global Network Services Multi-Award IDIQ Contract
January 26, 2016 | Harris CorporationEstimated reading time: 1 minute
Harris Corporation was one of eight awardees of a multi-award Global Network Services (GNS) IDIQ follow-on contract by the Defense Information Systems Agency (DISA). The IDIQ contract has a ceiling of $4.3 billion and consists of a five-year base and an additional five one-year options.
The contract provides leased telecommunications services to more than one million U.S. Defense Department users worldwide via the Defense Information Systems Network (DISN) and the Department of Defense Information Network (DoDIN).
"As DISA continues to transform the way it offers network services, incorporating fast-changing and evolving IT capabilities into a single global network is critically important," said Carl D'Alessandro, president, Harris Critical Networks. "Harris' proven dynamic bandwidth management architecture ensures DISA will have an architecture agile enough to support current and future customer needs. DISA already counts on Harris to provide bandwidth services at hundreds of locations along the East Coast of the United States."
The contract will help DISA acquire and deliver telecommunications network services at the enterprise level and will provide end-to-end classified and non-classified information transmission services and capabilities. GNS will enable customizable turn-key global transport solutions. DISA will leverage GNS capabilities to shift from point-to-point circuits to newer technical approaches, including metropolitan area networks, network solutions, short-term circuit leases, fiber, and new services that become commercially available.
About Harris Corporation
Harris Corporation is a leading technology innovator, solving our customers’ toughest mission-critical challenges by providing solutions that connect, inform and protect. Harris supports customers in more than 125 countries, has approximately $8 billion in annual revenue and 22,000 employees worldwide. The company is organized into four business segments: Communication Systems, Space and Intelligence Systems, Electronic Systems, and Critical Networks.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
Real Time with… IPC APEX EXPO 2024: The Latest Advancements in Dry Storage
04/30/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont and Super Dry Totech's Jordan Mandel discuss the latest developments in dry storage solutions, the J standard, and the ongoing challenge of moisture management while highlighting the industry's shift toward smart solutions and the importance of seeking expert help for moisture mitigation.
Keysight Secures New Test Case Validations for Narrowband Non-Terrestrial Networks Standard
04/30/2024 | Keysight TechnologiesKeysight Technologies, Inc. has validated new conformance test cases for 3rd Generation Partnership Project (3GPP) Release 17 (Rel-17) standards for non-terrestrial networks (NTN) using narrowband internet of things (NB-IoT) technology.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.