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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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American Standard Circuits to Exhibit at the 2026 Farnborough International Airshow

07/14/2026 | American Standard Circuits
American Standard Circuits (ASC), one of North America's leading manufacturers of advanced printed circuit boards for aerospace, defense, medical, industrial, and high-reliability applications, will be exhibiting at the Farnborough International Airshow taking place July 20–24, 2026 in Farnborough, United Kingdom.

Sumitomo Chemical Subsidiary to Establish of a Joint Venture with Samsung Electro-Mechanics for the Glass Core Substrate Business

07/13/2026 | Sumitomo Chemical
Sumitomo Chemical today announced that its wholly owned Korean subsidiary, Dongwoo Fine-Chem Co., Ltd. , has signed a joint venture agreement with Samsung Electro-Mechanics Co., Ltd. to establish a joint venture company that will engage in the business of glass core substrates for advanced semiconductor packages.

HyRel Technologies’ Brian Watson to Present at SMTAI 2026

07/13/2026 | HyRel Technologies
Brian Watson, Managing Partner and Co-Founder of Hyrel Technologies, will present “The Challenges of Proper Tinning” at the 2026 SMTA International Conference and Exposition in Rosemont IL., Oct. 25-29, 2026.

SEALSQ, GlobalFoundries Partner to Accelerate Post-Quantum Cryptography and Quantum Computing Technologies

07/10/2026 | Globe Newswire
SEALSQ Corp and GlobalFoundries announced a strategic Memorandum of Understanding (MoU) to co-develop across secure semiconductor platforms, Post-Quantum Cryptography (PQC) and emerging semiconductor-based quantum computing technologies.

Zuken Joins TSMC’s Open Innovation Platform® EDA Alliance

07/08/2026 | Zuken
Zuken Inc. announced that it has joined the EDA Alliance in TSMC’s Open Innovation Platform® (OIP).
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