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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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REMTEC to Participate at PCB West 2026, Showcasing Advanced Ceramic PCB Technologies for High-Reliability Electronics

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President & CEO Brian Buyea invites Engineers, Designers and OEMs to discover the future of advanced ceramic circuit solutions.

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LITEON Invests in DenseLight to Strengthen Optical Communications for AI Infrastructure

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SIA Commends CHIPS Awards to Accelerate Advanced Compute Semiconductor R&D

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The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding seven R&D awards announced by the CHIPS Research and Development Office (CRDO) to accelerate semiconductor R&D for the advanced compute supply chain.

Amphenol Reports Record Q2 2026 Results, Sales Reach $8.8B

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The Company continues to deploy its financial strength in a variety of ways to increase shareholder value. During the second quarter, the Company purchased 1.5 million shares of its common stock for $208 million and paid dividends of $307 million, resulting in total capital returned to shareholders of $515 million.
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