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In this issue, we (and AI) explored how and when artificial intelligence plays a role in manufacturing today. Whether on the factory floor, or in the front office, AI applications are emerging and changing how we approach planning, processes and problem solving.
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SMTA Seeks Tech Papers for Presentation at ICSRJanuary 28, 2016 | SMTA
Estimated reading time: Less than a minute
The Surface Mount Technology Association (SMTA) is inviting the industry to share their research for presentation at the 10th Annual International Conference on Soldering and Reliability (ICSR), which will be held from May 9–11, 2016 in Toronto, Canada.
For those interested in presenting, please submit a 200-300 word abstract to Jenny Ng at email@example.com on or before February 1, 2016. Authors will be notified of acceptance by February 15, 2016. Technical papers are required and will be due on March 21, 2016.
Suggested topics to be covered include Lead-free Assembly Processes, including Test; solder joint reliability under temp cycling, mechanical shock/drop, after aging; tin whiskers; electromigration; thermal dissipation; environmental compliance/regulations; conformal coating; manufacturing process; mechatronics; corrosion; lead free die attach soldering; and new solder paste technologies, to name few.
To submit an abstract, click here.
Indium Corporation Regional Product Manager Wisdom Qu will present at the SMTA China South Technical Conference, held in conjunction with NEPCON Asia, on October 11 in Shenzhen, China.
The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
Nihon Superior Co. Ltd. is pleased to announce that Keith Sweatman, the company's Senior Technical Advisor, will deliver a presentation titled "A Path to Ductile Low-Temperature Solders for Mass Production of Electronic Assemblies" at the upcoming SMTA International conference and exposition.
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Kyocera International has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
Conecsus Metals México, an innovative environmental technology and recycling company, will exhibit at the SMTA Foro Tecnico & Expo, Guadalajara, Jalisco, México, on Wednesday, October 25, 2023, beginning at 11:00 a.m.