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Cadence’s OrCAD Capture Supports Intel Schematic Connectivity FormatFebruary 17, 2016 | Cadence Design Systems, Inc.
Estimated reading time: 1 minute
Cadence Design Systems’ OrCAD Capture now provides export capability for Intel Schematic Connectivity Format (ISCF), targeted at automating Intel-based design reviews. ISCF was developed by Intel to streamline the collaboration process with its customers. Intel worked with Cadence to develop a direct ISCF generation capability in OrCAD Capture to make this collaboration process simpler and more efficient. Customers requiring a review with Intel's Customer Solutions Team in its Sales and Marketing Group (SMG) can now exchange design data in an Intel-approved format, optimizing the design review process.
By enabling the user to directly export hierarchical schematic designs in ISCF, OrCAD Capture improves upon the traditional method, which required Intel engineers to manually migrate the schematics. Customers can benefit from having their designs reviewed against specific guidelines early in the design cycle. They can then address issues sooner in the process, improving time to market.
"We review many schematics in OrCAD Capture/CIS format," said Rui Wang, vice president and general manager of the Technical Enablement Group in Intel's Sales and Marketing Group. "We expect this export capability from Cadence tools will significantly improve our efficiency and our customers' time to market."
"By integrating OrCAD Capture with ISCF, we are able to enable designers of IoT, wearable and mobile applications to receive faster Intel design reviews, reducing risk and cost and speeding time to market," said Steve Durrill, senior product engineering group director of the PCB Group at Cadence. "Many of Intel's growing customer base are already using our tools, and they can now leverage ISCF export to streamline their process of bringing innovative products to market."
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
There are many ways, dozens to be sure, and most likely many more, to streamline a PCB design. My goal here is to pick a single-digit number of rules to abide by, that can be reasonably adhered to, and provide some bang for the buck. These rules are meant to reduce design scope creep, avoid PCB respins, and improve production yields.
Hirose has expanded its low-profile DF51K wire-to-board connector series to include a surface mount technology (SMT) version. Compatible with automated assembly processes, including pick-and-place machines, the DF51K SMT Series simplifies the assembly process and saves significant manufacturing time and cost.
Siemens Digital Industries Software set the benchmark for innovation in the field of engineering simulation with the launch of two groundbreaking solutions - HEEDS™ AI Simulation Predictor software and Simcenter™ Reduced Order Modeling software.
I am, at heart, a die-hard “Star Trek” fan. When I was a kid, I was all about phasers, warp drive, and cool stuff like that. However, these days, I tend to put a higher value on production and storytelling. But like any fan (I’m avoiding “Trekkie” because, frankly, it’s kind of embarrassing), I have certain moments from the hundreds (if not thousands) of hours filmed for the various TV shows and movies that are among my favorites. One of those moments is in “Star Trek III, The Search for Spock,” when our heroes steal the Starship Enterprise from space dock.
To sustain a standard of excellence, it’s equally important to look at both what we’re doing today as well as what we’ll do in the future. In other words, plan ahead. In that spirit, I thought it would be prudent to peek into the future and talk about what a printed circuit board fabrication facility with a “standard of excellence” will look like five years from now.