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Register Now for Cadence’s CDNLive Silicon Valley
March 9, 2016 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Don’t miss the Early Bird $99 registration pricing for CDNLive Silicon Valley. This annual conference brings together Cadence users, developers, and industry experts to connect, share ideas, and inspire design creativity. Take advantage of this unique opportunity to investigate design challenges and share solutions with people who, like you, are excited about the latest advances in electronic design.
CDNLive Silicon Valley 2016 takes place at the Santa Clara Convention Center April 5-6, 2016. Highlights include:
- User-presented technical papers that will immediately help improve how you use Cadence technologies
- Executive keynotes offering insights into industry trends and innovations
- Peer networking opportunities
- Live product demos and technology updates
Papers: Choose from a wide variety of user-authored papers addressing all aspects of IP integration, SoC design, and system integration as well as board design, implementation, signoff, and verification. Discover how others are using Cadence technologies and techniques to develop successful silicon, SoCs, and systems.
Keynote speakers: Hear from industry leaders who influence the global electronics marketplace as they discuss industry trends in silicon, SoC, and system realization and share their thoughts on how to solve the most pressing design challenges. Keynote speakers will be announced soon!
Designer Expo: Check out our showcased solutions and new products co-developed by Cadence and Cadence Connections partners.
Networking opportunities: Engage in technical discussions with your peers and stay connected after the conference.
Early Bird registration ends March 18, 2016.
Click here to register.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.