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Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
Simulation, Analysis, and AI
Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
Advanced, Complex & Emerging Designs
This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
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Register Now for Cadence’s CDNLive Silicon ValleyMarch 9, 2016 | Cadence Design Systems, Inc.
Estimated reading time: 1 minute
Don’t miss the Early Bird $99 registration pricing for CDNLive Silicon Valley. This annual conference brings together Cadence users, developers, and industry experts to connect, share ideas, and inspire design creativity. Take advantage of this unique opportunity to investigate design challenges and share solutions with people who, like you, are excited about the latest advances in electronic design.
CDNLive Silicon Valley 2016 takes place at the Santa Clara Convention Center April 5-6, 2016. Highlights include:
- User-presented technical papers that will immediately help improve how you use Cadence technologies
- Executive keynotes offering insights into industry trends and innovations
- Peer networking opportunities
- Live product demos and technology updates
Papers: Choose from a wide variety of user-authored papers addressing all aspects of IP integration, SoC design, and system integration as well as board design, implementation, signoff, and verification. Discover how others are using Cadence technologies and techniques to develop successful silicon, SoCs, and systems.
Keynote speakers: Hear from industry leaders who influence the global electronics marketplace as they discuss industry trends in silicon, SoC, and system realization and share their thoughts on how to solve the most pressing design challenges. Keynote speakers will be announced soon!
Designer Expo: Check out our showcased solutions and new products co-developed by Cadence and Cadence Connections partners.
Networking opportunities: Engage in technical discussions with your peers and stay connected after the conference.
Early Bird registration ends March 18, 2016.
Click here to register.
Industry visionaries and experts will gather November 6-8 at the MEMS & Sensors Executive Congress (MSEC 2023) at the WIGWAM Resort in Phoenix, Arizona for insights into the latest trends and innovations in sensorization.
Gen3 Appoints John Barraclough as Head of Business Development Following Retirement of Nick Redgrave-Plumb10/02/2023 | Gen3
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, is pleased to announce the appointment of John Barraclough as the Head of Business Development.
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, announced that Debbie Carboni, Global Product Line Manager - Electronics, will present as part of the Electric Vehicle (EV) panel during the IPC High Reliability Forum.
This joint effort is expected to strengthen the supply of NANOWEB® films and accelerate the growth of the transparent conductive film industry, offering new applications for the automotive and consumer electronics sectors, such as transparent film antennas, transparent film heaters, and transparent film electromagnetic shielding.
USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics09/29/2023 | USPAE
In a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.