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The Standards of Design
Our expert contributors discuss how PCB designers can utilize standards to save time and money, not to mention frustration. We also spotlight the newly updated version of the IPC Checklist, a handy guide that illustrates which standards cover which topics, from front-end design through assembly.
Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
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Register Now for Cadence’s CDNLive Silicon ValleyMarch 9, 2016 | Cadence Design Systems, Inc.
Estimated reading time: 1 minute
Don’t miss the Early Bird $99 registration pricing for CDNLive Silicon Valley. This annual conference brings together Cadence users, developers, and industry experts to connect, share ideas, and inspire design creativity. Take advantage of this unique opportunity to investigate design challenges and share solutions with people who, like you, are excited about the latest advances in electronic design.
CDNLive Silicon Valley 2016 takes place at the Santa Clara Convention Center April 5-6, 2016. Highlights include:
- User-presented technical papers that will immediately help improve how you use Cadence technologies
- Executive keynotes offering insights into industry trends and innovations
- Peer networking opportunities
- Live product demos and technology updates
Papers: Choose from a wide variety of user-authored papers addressing all aspects of IP integration, SoC design, and system integration as well as board design, implementation, signoff, and verification. Discover how others are using Cadence technologies and techniques to develop successful silicon, SoCs, and systems.
Keynote speakers: Hear from industry leaders who influence the global electronics marketplace as they discuss industry trends in silicon, SoC, and system realization and share their thoughts on how to solve the most pressing design challenges. Keynote speakers will be announced soon!
Designer Expo: Check out our showcased solutions and new products co-developed by Cadence and Cadence Connections partners.
Networking opportunities: Engage in technical discussions with your peers and stay connected after the conference.
Early Bird registration ends March 18, 2016.
Click here to register.
The General Assembly of the European Semiconductor Industry Association (ESIA), representing the European semiconductor industry and broader ecosystem, unanimously confirmed Jochen Hanebeck, Chief Executive Officer of Infineon Technologies, as the new ESIA President for a two-year mandate. Mr Hanebeck is succeeding NXP Semiconductors’ President and CEO Kurt Sievers.
Indium Corporation is proud to announce the addition of Sales Engineer Meik Fratzel to its European team.
SEMI announced the SEMI Leadership Accelerator to foster industry growth by assisting organizations in cultivating the next generation of leaders.
For this month's PCBAA Member Profile, the focus is on Hari Pillai, president, Technology Components, Sanmina. Hari says, "I think I’ve had a good dose of luck throughout my career. But beyond luck, I had a vision to become a general manager as far back as my undergraduate years. I made all my career decisions based on that. My evaluation criteria was always, “How does this opportunity get me closer to my goal?” Sometimes opportunities come from unexpected places."
American Standard Circuits to Exhibit at the 60th Annual Association of Old Crows International Symposium and Convention 202312/05/2023 | American Standard Circuits
West Chicago, Illinois-based PCB fabricator American Standard Circuits will be exhibiting at this year’s Annual Association of Old Crows International Symposium to be held from December 11 through the 13th in National Harbor, Maryland.