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Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
Simulation, Analysis, and AI
Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
Advanced, Complex & Emerging Designs
This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
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Register Now for Cadence’s CDNLive Silicon ValleyMarch 9, 2016 | Cadence Design Systems, Inc.
Estimated reading time: 1 minute
Don’t miss the Early Bird $99 registration pricing for CDNLive Silicon Valley. This annual conference brings together Cadence users, developers, and industry experts to connect, share ideas, and inspire design creativity. Take advantage of this unique opportunity to investigate design challenges and share solutions with people who, like you, are excited about the latest advances in electronic design.
CDNLive Silicon Valley 2016 takes place at the Santa Clara Convention Center April 5-6, 2016. Highlights include:
- User-presented technical papers that will immediately help improve how you use Cadence technologies
- Executive keynotes offering insights into industry trends and innovations
- Peer networking opportunities
- Live product demos and technology updates
Papers: Choose from a wide variety of user-authored papers addressing all aspects of IP integration, SoC design, and system integration as well as board design, implementation, signoff, and verification. Discover how others are using Cadence technologies and techniques to develop successful silicon, SoCs, and systems.
Keynote speakers: Hear from industry leaders who influence the global electronics marketplace as they discuss industry trends in silicon, SoC, and system realization and share their thoughts on how to solve the most pressing design challenges. Keynote speakers will be announced soon!
Designer Expo: Check out our showcased solutions and new products co-developed by Cadence and Cadence Connections partners.
Networking opportunities: Engage in technical discussions with your peers and stay connected after the conference.
Early Bird registration ends March 18, 2016.
Click here to register.
TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum.
The Semiconductor Industry Association (SIA) announced Geoff Martha, chairman and CEO of healthcare technology leader Medtronic, will be the keynote presenter at the 2023 SIA Awards Dinner on Thursday, Nov. 16 in San Jose, Calif.
GlobalFoundries (GF) announced the official opening of a new hub facility in Penang, Malaysia.
Founder of HyRel Technologies Brian Watson to Present at SMTA International on Workforce Development09/27/2023 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to announce that Brian Watson, the company’s Founder and President, will be a featured presenter at SMTA International. The event is scheduled to take place on Tuesday, October 10.
The new World Robotics report recorded 553,052 industrial robot installations in factories around the world – a growth rate of 5% in 2022, year-on-year.