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IPC APEX EXPO: Glenn Oliver on His IPC 'Best Paper' on High-Frequency Materials
March 16, 2016 | Real Time with...IPCEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/2916/3120/5761/Glenn_Oliver.jpg)
Glenn Oliver of DuPont discusses his award-winning paper, “Round Robin of High-Frequency Test Methods by IPC-D24C Task Group." Co-authors include Jonathan Weldon of DuPont, John Andresakis of Park Electrochemical, Chudy Nwachukwu of Isola, John Coonrod of Rogers Corporation, David L. Wynants of Taconic Advanced Dielectric Division, and Don DeGroot of Connected Community Networks, Inc. The paper looks at high-frequency offerings from a variety of materials providers.
To watch this video, click here.
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Give Yourself an Edge at the IPC High Reliability Forum 2024
08/27/2024 | Marcy LaRont, PCB007 MagazineFor those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.