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Current IssueRigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
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Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
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This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
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IPC APEX EXPO: Glenn Oliver on His IPC 'Best Paper' on High-Frequency Materials
March 16, 2016 | Real Time with...IPCEstimated reading time: Less then a minute

Glenn Oliver of DuPont discusses his award-winning paper, “Round Robin of High-Frequency Test Methods by IPC-D24C Task Group." Co-authors include Jonathan Weldon of DuPont, John Andresakis of Park Electrochemical, Chudy Nwachukwu of Isola, John Coonrod of Rogers Corporation, David L. Wynants of Taconic Advanced Dielectric Division, and Don DeGroot of Connected Community Networks, Inc. The paper looks at high-frequency offerings from a variety of materials providers.
To watch this video, click here.
Suggested Items
IPC Day France: Aerospace Electronics
09/18/2023 | IPCIPC Day France: Aerospace Electronics is an aerospace-focused networking event featuring key industry experts from NASA and Airbus and will take place on October 2, 2023 .
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
09/15/2023 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023.
An Overview of Rigid-flex Design
09/13/2023 | I-Connect007 Editorial TeamFor this month’s issue on rigid-flex design, we spoke with instructor Kris Moyer, who teaches the IPC class “PCB Design for Flex and Rigid-Flex Boards.” In this wide-ranging interview, Kris breaks down the hurdles facing rigid-flex designers and offers a variety of solutions for rigid board designers taking on their first rigid-flex circuits. He also provides a few horror stories to illustrate what happens if you don’t follow sound design practices, rules, and standards. And, as Kris points out, “Your fabricator is your friend.”
Winners of IPC Hand Soldering and Rework Competition at NEPCON Vietnam 2023 Announced
09/13/2023 | IPCIn conjunction with NEPCON Vietnam 2023, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam on September 6-8, 2023.
Sinclair Manufacturing Orders Hentec/RPS Pulsar Solderability Testing and Photon Steam Aging Systems
09/13/2023 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Sinclair Manufacturing has purchased Pulsar solderability testing and Photon steam aging systems for installation in their Chartley, Massachusetts facility.