The New Chapter: The Benefits of Continuing Education
It’s Only Common Sense: You’ve Got to Hustle
Matrix's NEW Hakuto Dry Film Laminator Impresses at IPC
April 14, 2016 | MatrixEstimated reading time: 1 minute
Matrix is delighted with customer reaction at last month’s North American IPC unveiling of the new Hakuto Mach 630NP/6630NP Series Dry Film Laminators and is now ready to provide Sales and Service to all regions of North America.
During the recent APEX/IPC Show in Las Vegas, customers were amazed at the new and Innovative technology such as changing rolls in a matter of seconds.
Matrix believes the NEW Hakuto Mach 630NP Dry Film Laminator will change the game for PCB manufacturing.
Fred Long, Matrix Business Development says: “The new Mach 630NP machine addresses the accuracy needed to assist in the transfer of very fine lines on the latest HSLL laminates using Super Low Profile Copper surfaces. This is made possible by the new Lamination Module with its EVEN Heat and EVEN Pressure across the entire surface of the laminated panel. In addition, the ability to change the rubber lamination rolls in seconds will not only increase productivity but will also offer alternative “quick change” rubber solutions for different product needs. The complete redesign of the film lamination approach will now begin to reach the most important users of this latest technology. Matrix is eager to show manufacturers that by using the new system, Productivity and Yield will now surpass all traditional ROI expectations.”
See the PCB007 IPC Interview with Dan Feinberg and Fred Long discussing the new laminating machine and its innovative features, click here.
During the next few weeks, Matrix is scheduled to place additional machines in three specific regional areas in the US. Customers will then be able to travel to these sites and see the machines in operation.
About Matrix USA Inc.
Committed to the motto, “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw materials to the North American Printed Circuit Board Industry. Matrix has four rapid-response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information, click here.
Share on:
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.