Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Reports Indicate TSMC to Tighten Scrutiny on Chinese AI Chip Clients; Potential Revenue Impact Between 5% to 8%

11/11/2024 | TrendForce
Reports suggest that TSMC has notified its Chinese clients of a temporary suspension on shipments of advanced AI chips produced using 7nm and below process nodes.

TTM’s Grand Opening in Malaysia

11/07/2024 | Marcy LaRont, I-Connect007
When I last spoke with Tom Edman, president and CEO of TTM Technologies (TTM), he provided an update about the company’s new high-tech printed circuit board facility under construction in Syracuse, New York, and how the grand opening of a facility in Malaysia is informing TTM’s overall expansion efforts: a cutting-edge facility spread across 27 acres and providing roughly 1,000 jobs. Now, Tom provides more details about the new automated facility, its regional and global impact, and the importance of having both government and industry support.

One Partial HDI Technique: mSAP 

11/05/2024 | Andy Shaughnessy, Design007 Magazine
Chris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.

Nolan's Notes: The Rise (and Risk) of Data

11/05/2024 | Nolan Johnson -- Column: Nolan's Notes
Last month, I read about a United Airlines flight that declared an emergency over the middle of Hudson Bay in northern Canada. All the cockpit screens had gone blank and both flight management computers had entered into a “degraded mode with limited capabilities.” The pilots had lost most of their autopilot functionality, but still had enough control systems to manually fly the plane to a safe landing at O’Hare.

Root-cause Analysis and Problem-solving

11/01/2024 | Happy Holden, I-Connect007
An essential skill for any process engineer in printed circuit fabrication is the ability to conduct root-cause analysis (RCA) and problem-solving. These are related to TQC and Six Sigma applications and are essential for customer support and continued profitability. All engineers will encounter these methods sooner or later, but it will likely be sooner if you are in product or process engineering in manufacturing.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in