-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Orange Co. DC Chapter Meeting: PCB Cost Adders
June 1, 2016 | IPC Designers Council, Orange Co. ChapterEstimated reading time: 1 minute
The Orange County Chapter of the IPC Designers Council will hold a "Lunch 'n' Learn" meeting on Wednesday, June 15 in Irvine, California. Guest speaker Julie Ellis of TTM Technologies will focus on PCB cost-driving factors that should be considered early in the design phase to save your company money.
A designer is faced with many challenges when planning your layout to achieve a balance of performance, quality and reliability versus cost. In this presentation, Julie Ellis of TTM Technologies will discuss the many factors that contribute to cost and explore the trade-off considerations for design optimization.
She will explore panel utilization, layer count, material selection, via structure choices, via-filling options, the impact of various sequential laminations, plating processes, surface finishes, scoring, milling and back drilling. Attendees will learn various rules of thumb to help you make better choices for mitigating the cost of the boards you design.
Reserve a spot on your calendar on Wednesday, June 15 from 11:30 am to 1:30 pm for this educational “Lunch ‘n Learn” meeting event.
Date: Wednesday June 15, 2016
Time: 11:30 am - 1:30 pm
Where: Harvard Athletic Park multi-purpose room, Irvine, California
Please RSVP no later than noon on Tuesday, June 14, 2016
There are two ways to RSVP:
- Click here to RSVP
- Or email your RSVP to terri_kleekamp@mentor.com.
Location
Harvard Athletic Park
14701 Harvard Ave.
Irvine, California 92606
(The multi-purpose room is at the SOUTH end of the athletic fields)
Suggested Items
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”
Closing the Loop: iNEMI Workshop Addresses Circularity Challenges
12/09/2024 | Kelly Scanlon, IPC Lead Sustainability StrategistThe electronics industry faces increasing pressure from consumers and regulators to implement more circular design principles in their products. While some companies lead the way, many grapple with significant knowledge gaps. These include a lack of clear definitions for "circular economy" in the context of electronics, insufficient data, and inadequate training to apply circular principles effectively across product lifecycles. Additionally, there's a pressing need to understand the return on investment (ROI) and other potential incentives for implementing circular principles.
2024 IPC K-FEST: Shaping the Future of the Electronics Industry
12/06/2024 | IPCIPC K-FEST 2024, the 2nd annual IPC Korea Festival of Electronics Standards and Technology, was held in Seoul on October 29. The focus of this year’s event centered on the integration of Korea's technological leadership with international standards development.
The Training Connection Difference
12/04/2024 | Andy Shaughnessy, I-Connect007Bert Horner, president of The Test Connection, has recently launched The Training Connection, a new company that addresses critical training needs in test engineering and development. With a focus on essential methodologies like design for test (DFT) and IPC standards, the initiative promises to enhance the skills of professionals in the field. At PCB Carolina, Bert talked about the program, its positive reception, and the growing demand for practical, effective training solutions within the industry.