-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Registration Sweet Spot
Registration is underrated and underappreciated. The key is to ensure proper registration from layer to layer across the entire printed circuit board. It’s a holistic process requiring anticipation, prediction, precise attention at each step, and detailed data tracking and monitoring.
High-reliability Fabrication
In this month’s issue, our expert contributors discuss the latest in technologies, trends, complexities and resources regarding high-reliability fabrication.
Finding Ultra
New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. Is it time to start paying close attention to this convergence?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Ventec International Group Earns ISO 9001:2015 Certification for its German Facility
June 28, 2016 | Ventec International GroupEstimated reading time: 2 minutes

Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is proud to announce that its Central European facility located in Kirchheimbolanden, Germany has received certification under the ISO 9001:2015 quality management standard.
The nearly 3000sqm manufacturing, distribution and sales facility in Germany is the company's latest location within its global network of manufacturing and service centers in Asia, Europe and the USA to receive the ISO 9001:2015 quality standard. ISO 9001:2015 is an internationally recognized standard that specifies requirements for a quality management system (QMS). The standard helps organizations consistently meet the needs of customers and other key stakeholders in both the delivery and continuous improvement of products and services.
PCB fabrication customers can continue to rely on Ventec's fully accredited supply chain for high reliability laminates and pre-pregs. From manufacture through fabrication and delivery, Ventec's high quality product portfolio of polyimides, high reliability FR4 and its latest 'tec-speed' range of high speed/low loss materials are all covered by the accreditation.
"Receiving the ISO 9001:2015 certification at our German facility is another key milestone in our roadmap to offer a full complement of PCB base-products and service options for our customers," said Thomas Michels, Managing Director Europe. "In addition to providing products and solutions that adhere to the stringent quality requirements expected from our customers, Ventec takes great pride in helping our customers around the world to optimize their operational efficiency to better serve their customers."
"Today, our customers are faced with a significantly more competitive environment with tighter regulatory demands across industries," said Mark Goodwin, COO Ventec International Group. "They are looking to strategically partner with companies like Ventec for the supply of reliable materials and services to increase quality and lower their operating costs as a differentiated business model to maximize their own resources. By earning ISO 9001:2015 and other certifications such as AS9100 Rev C for aerospace and ISO/TS16949 for automotive, Ventec can offer our customers the highest possible quality standards and cost structure transformation through an improved and fully controlled supply chain, innovation and long term strategic partnerships."
For more information about Ventec’s solutions and the company’s wide variety of products, please click here.
About Ventec International Group
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry.
Suggested Items
Shortage of Raw Materials Challenges CCL Market Amidst Strong Demand for Electronic Devices
11/13/2023 | Global NewswireThe "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
SCHMID Group to Exhibit at productronica
11/07/2023 | SCHMID GroupThe SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
Financial Risks of Ignoring Copper Grain
11/01/2023 | Alex Stepinski, Stepinski GroupThe topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
Advanced Materials Update with John Andresakis
10/26/2023 | Andy Shaughnessy, Design007At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Material Insight: The Material Science of PCB Thermal Reliability
10/25/2023 | Preeya Kuray -- Column: Material InsightPrinted circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.