Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Rehm Expands Worldwide Sales Network
July 14, 2016 | Rehm Thermal SystemsEstimated reading time: 1 minute
Carsten Kramer, Global Solar Director and Director for Southeast Asia
Kramer has been a new point of contact at Rehm photovoltaics since 1 April 2016. He is responsible for coordinating the worldwide sales activities for solar equipment and strategic development, in direct consultation with management. In addition, as Director for Southeast Asia, he will be managing the markets of Southeast Asia, India and Korea.
"I'm primarily focused on the expansion of the distribution structure, supporting it, on-site customer support and strengthening our position in the region," stresses Kramer. "With Rehm, I have joined an up-and-coming company with an exceptional reputation in the market."
He has worked in the industry for almost eight years as a managing director, among others, for thermal systems and solar products as well as the previous ten years in various positions at well-known companies in the automotive industry.
Dr. Klaus Brodt, Sales for Reflow Condensation Soldering Systems and Special Systems
Dr. Brodt joined the Rehm team on 1 June 2016 for the worldwide sales of CondensoX reflow condensation soldering systems and special systems for drying and tempering. After having successfully completed his doctorate as a physicist (specializing in heat transfer), he has gained extensive experience in the sale and further development of soldering systems, especially in the fields of reflow, vapor phase soldering and solder wave.
"It has always been of great importance to me to understand specific requirements in dialogue with the customer, in order to jointly configure a machine that perfectly meets expectations. At Rehm – a renowned company for forward-looking system technologies – we will further expand the condensation soldering sector and drive the market forward," says Dr. Brodt.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.