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Ventec International Doubles IMS Material Manufacturing Capacity with $2M Equipment Investment
September 2, 2016 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group has doubled its B-series Insulated Metal Substrate (IMS) materials production capacity at its Jiangyin, China facility. The company has invested USD 2 million in leading edge production equipment that boost IMS materials production capacity 100% above prior levels.
Image: Ventec raises production capability & control for IMS production line with increased capacity
To meet the growing demand for high performance IMS materials that deliver an ever-increasing level of thermal performance, reliability and quality, particularly for automotive and other LED lighting and DC power conversion applications, Ventec has invested in new manufacturing equipment at its Jiangyin, China facility. Following a successful initial trial period, the latest production line, which includes a Resin Coater, automated build up, aluminum surface treating equipment, and an inline High Pot Tester, is now fully operational for mass production.
Image: Ventec’s new Resin Coater doubles IMS Materials capacity
Along with the significant capacity expansion, the latest investment also ensures enhanced production capability for Ventec’s VT-4B family of thermally conductive IMS, which deliver an unprecedented level of thermal performance through their established ceramic-filled halogen-free dielectric technology. Multilayered constructions are made possible through resin-coated foil and resin-coated film options.
Image: Thermal Management Solutions & IMS Materials Performance Overview from Ventec
Ventec’s General Manager Jason Chung said the company is on track with its ambitious global growth plan which includes strategic investment in new technologies and production equipment that expand its product offerings and leverage production resources. “With the market need for ever-increasing thermal performance, Vantec’s IMS Materials product pipeline and manufacturing capacity expansion are now well positioned to cost-effectively meet the needs of customers around the globe,” Chung said.
Mark Goodwin, Ventec’s COO Europe & USA, added “the Jiangyin facility’s expanded production capacity positions Ventec to serve as a leading high-volume, high-quality supplier of materials to customers requiring reliable IMS solutions,”.
About Ventec International Group
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.
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NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
02/25/2026 | I-Connect007 Editorial TeamThe I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip
02/19/2026 | Matt Stevenson -- Column: Connect the DotsThe demand for ultra-high density interconnect (UHDI) PCBs is growing as electronic devices become increasingly advanced. That means we will be creating more designs that need to align with the reality of manufacturing UHDI boards. My last column on this subject focused on plating, and we are ready to discuss the strip-etch-strip (SES) process. With UHDI boards, footprints are smaller and tolerances are tighter. Your big design challenge associated with the SES process involves trace width and spacing control. The etching process can undercut traces and alter their final size.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Connect the Dots: The Future of Designing for Reality—Pattern Plating
02/05/2026 | Matt Stevenson -- Column: Connect the DotsLast month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.