-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Amphenol Invotec Tamworth Facility Adds Machinery From Viking Test
September 5, 2016 | Amphenol InvotecEstimated reading time: 1 minute
Amphenol Invotec, Europe’s leading manufacturer of time-critical, high-technology PCBs has commissioned a new Pluritec Inspecta Combo HPL X-Ray drill with complete automation, from Viking Test for its facility in Tamworth.
Offering a one-stop solution, the Inspecta Combo HPL combines four machines in one system. The patented "One Step X-Ray drilling & Routing" function will perform, via X-Ray system, panel target detection and deformation compensation (linear, non-linear rotation, offset and scaling) and direct drilling or routing. Optical alignment capability further enhances registration options for specialised applications.
Enhanced capability, versatility and flexibility make the COMBO HPL an ideal choice for the processing of complex multi-layer, and rigid-flex PCBs at Amphenol Invotec. Large panel format capability falls in line with Invotec’s ongoing investment to increase panel size capability across all manufacturing areas.
Tim Tatton, General Manager of Amphenol Invotec, said, "We specialize in complex, high layer-count, high-reliability PCBs, which means that we are increasingly working with thin and varied materials, including variable copper weights. Registration challenges are ever tighter and this machine will give us a significant step forward in driving yield improvements and through automation reducing cycle time & costs, which is good news for Amphenol Invotec and our customers."
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Connect the Dots: The Future of Designing for Reality—Pattern Plating
02/05/2026 | Matt Stevenson -- Column: Connect the DotsLast month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.
PCBAIR Upgrades Heavy-Copper PCBs to Solve AI Thermal Bottlenecks
01/20/2026 | PRNewswireAs computational demands for AI models surge, the hardware powering them faces a critical physical limitation: thermal management.
TÜV Rheinland Advances Electronics Supply Chain Traceability
01/13/2026 | BUSINESS WIREWith electronic devices being replaced at an ever-faster pace, global volumes of consumer e-waste continue to climb.