Dan’s Biz Bookshelf: ‘iWar: Fortnite, Elon Musk, Spotify, WeChat, and Laying Siege to Apple’s Empire’
Driving Innovation: Size Matters—Navigating the Challenges of XXL PCB Production
It’s Only Common Sense: Reinvention Is a Fundamental Leadership Responsibility
Amphenol Invotec Tamworth Facility Adds Machinery From Viking Test
September 5, 2016 | Amphenol InvotecEstimated reading time: 1 minute
Amphenol Invotec, Europe’s leading manufacturer of time-critical, high-technology PCBs has commissioned a new Pluritec Inspecta Combo HPL X-Ray drill with complete automation, from Viking Test for its facility in Tamworth.
Offering a one-stop solution, the Inspecta Combo HPL combines four machines in one system. The patented "One Step X-Ray drilling & Routing" function will perform, via X-Ray system, panel target detection and deformation compensation (linear, non-linear rotation, offset and scaling) and direct drilling or routing. Optical alignment capability further enhances registration options for specialised applications.
Enhanced capability, versatility and flexibility make the COMBO HPL an ideal choice for the processing of complex multi-layer, and rigid-flex PCBs at Amphenol Invotec. Large panel format capability falls in line with Invotec’s ongoing investment to increase panel size capability across all manufacturing areas.
Tim Tatton, General Manager of Amphenol Invotec, said, "We specialize in complex, high layer-count, high-reliability PCBs, which means that we are increasingly working with thin and varied materials, including variable copper weights. Registration challenges are ever tighter and this machine will give us a significant step forward in driving yield improvements and through automation reducing cycle time & costs, which is good news for Amphenol Invotec and our customers."
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
02/25/2026 | I-Connect007 Editorial TeamThe I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip
02/19/2026 | Matt Stevenson -- Column: Connect the DotsThe demand for ultra-high density interconnect (UHDI) PCBs is growing as electronic devices become increasingly advanced. That means we will be creating more designs that need to align with the reality of manufacturing UHDI boards. My last column on this subject focused on plating, and we are ready to discuss the strip-etch-strip (SES) process. With UHDI boards, footprints are smaller and tolerances are tighter. Your big design challenge associated with the SES process involves trace width and spacing control. The etching process can undercut traces and alter their final size.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Connect the Dots: The Future of Designing for Reality—Pattern Plating
02/05/2026 | Matt Stevenson -- Column: Connect the DotsLast month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.