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PACE to Introduce BGA Rework System with Revolutionary Heater at SMTAI
September 13, 2016 | PACE WorldwideEstimated reading time: 2 minutes
PACE Worldwide will introduce its new TF 1800 BGA/SMD Rework System at the upcoming SMTA International conference in Rosemont, Illinois on September 27–28.
The TF 1800 incorporates a groundbreaking top-side inductive-convection heater, which provides rapid heat-up and active cooling of the solder joints, resulting in faster throughput and greater process control.
The patent-pending inductive-convection technology allows for an active cooling feature, which provides swift yet controlled component/PCB cool down, directly through the nozzle, yielding the highest quality joints. Its high efficiency, low thermal mass design takes far less power to operate and is more reliable than conventional heaters. An automated reflow head is driven by an advanced stepper motor, which provides smooth, ultra-precise, repeatable movement, with no drift, allowing for soft landing of components and 28μm (0.0011”) placement accuracy. In addition, an advanced vacuum pick/shaft design with optical sensor is counterweight balanced to eliminate placement pressure on components, and uses precision high temperature linear ball bearings for highest sensitivity in placement and pick-up.
PACE's exclusive adjustable height bottom-side IR preheater allows safe, closer proximity to the PCB for the most challenging high thermal mass boards. Other features include: an HD vision overlay system for optical alignment with quad-field imaging capability for placement of outsized BGAs or large fine-pitch QFPs; an integrated underside board support wand to prevent warping during reflow; and user-friendly software which guides operators through an intuitive interface that virtually automates the process.
For more information, please click here.
About PACE
PACE Worldwide has been providing the most innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Since the dawn of the modern electronics industry, PACE has played a key role in the development of groundbreaking products, training films, curricula, materials and electronic assembly standards, including several soldering, surface mount and thru-hole rework videos co-produced with the IPC and industry.
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