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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
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Anaheim Tech Center Showcases Pluritec, Ecospray & Limata Equipment
September 13, 2016 | PluritecEstimated reading time: Less than a minute
Circuit board manufacturing equipment provider Pluritec has partnered with laser direct imaging producer Limata to host Southern California's Technology Center. This west coast addition augments Pluritec’s North American headquarters in Bohemia, New York, making it more convenient for customers in the west to see the equipment in operation. Customer experience will be enhanced with local service, support and spare parts availability on the west coast as well. Additionally, the tech center will showcase latest technology offerings, hands-on testing/evaluation, and a focused training environment for continued customer and employee skills development. Visitors will be able to learn about affordable LDI systems on up through fully automated production systems at the center.
About Pluritec
Now part of Pluriservice group, Pluritec was originally founded in 1968 and has a long and successful history in the printed circuits board industry.
Headquartered in Turin, Italy, the company develops, designs and manufactures equipment for PCB fabrication and has over 2,000 installations worldwide.
About Limata
Limata develops and manufactures industry level precision Direct Imaging equipment for the PCB production based on UV LED and UV Laser technology.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Deep Space Energy Raises €930K Pre-Seed to Power Moon and Satellites
02/11/2026 | Deep Space EnergyLatvian startup Deep Space Energy has closed its pre-seed round by raising €350K, led by Outlast Fund and Linas Sargautis, an angel investor and a former co-founder of NanoAvionics.
SEMI Reports 2025 Annual Worldwide Silicon Wafer Shipments and Revenue Results
02/11/2026 | PRNewswireWorldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to $11.4 billion over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.
New Research Group: AT&S Strengthens Microelectronics at TU Graz
02/11/2026 | AT&SAT&S is setting another strategic milestone for the technological future of Europe and is funding the establishment of a new research group at Graz University of Technology (TU Graz) in the field of microelectronics with a focus on IC substrates and advanced packaging technologies.
Smart City Technologies Gain Global Momentum Across Core Urban Services
02/11/2026 | Berg InsightBerg Insight,released the latest edition of its comprehensive smart city technology report comprising in-depth studies of five key technology areas – smart street lighting, smart parking, smart waste collection, urban air quality monitoring and smart city surveillance.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.