Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Zentech Subsidiary Colonial Assembly and Design Receives $37.1M Navy Contract
September 14, 2016 | Zentech Manufacturing, Inc.Estimated reading time: Less than a minute
Colonial Assembly and Design, LLC., a wholly-owned subsidiary of Zentech Manufacturing, Inc. has received a United States Navy contract award in the amount of $37,191,138.00.
The contract is a firm-fixed-price, cost-plus-fixed-fee, indefinite-delivery/indefinite-quantity contract for providing design and fabrication, rapid prototyping, and technology integration related to circuit board design and radio frequency (RF) distribution assemblies, synthetic rope assemblies, mechanical fabrication, and fabric assemblies.
The Naval Surface Warfare Center Dahlgren Division, Dahlgren, Virginia, is the contracting activity (N00178-16-D-2025). This effort will support the Weapons Control and Integration Department.
Cynthia Snellings, VP Finance and Contracts at Colonial Assembly and Design comments, “we are extremely pleased to receive this five-year contract award and for the opportunity to continue our legacy of high-performance at Naval Surface Warfare Center - Dahlgren Division in support of our nation’s warfighters.”
About Colonial Assembly and Design:
Colonial Assembly and Design, LLC., a wholly-owned subsidiary of Zentech Manufacturing, Inc., is a privately held, engineering-driven contract manufacturer specializing in the design and manufacture of highly-complex electronic and RF circuit cards and assemblies. The company is headquartered in its purpose-built facility located in Fredericksburg, Va. and is ISO 9001:2008 certified and ITAR Registered.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.