Latest Articles

Mutracx Makes Green Operations Economically Viable

During IPC APEX EXPO, I sat down for an interview with with Jeroen de Groot, CEO of Mutracx. He detailed the company’s plans to install new equipment at a facility in Romania, and he explains why having a green manufacturing operation is not enough—it must also be economically feasible.

American Standard Circuits Discusses e-Book on Designing Flex and Rigid-Flex

American Standard Circuits is an industry leader when it comes to high-technology printed circuit boards, especially flex and rigid-flex printed circuit boards. So, it was natural that they would write about flex and rigid-flex for I-Connect007’s new “Guide to…” e-book series.

RTW IPC APEX EXPO: Sanjay Huprikar Lays Out Plans to Grow IPC Membership

Sanjay Huprikar, IPCs vice president of member success, discusses IPCs plans to expand membership around the world.

MACFEST: Benchmarking a New Solderable PCB Finish

New, innovative manufacturing procedures have been developed by the recently completed project, Manufacturing Advanced Coating for Future Electronics SysTems (MACFEST), which has been funded by several partners and the government’s Innovate UK.

RTW IPC APEX: HDPUG's Jack Fisher Discusses Updates on Optoelectronics Project

The HDPUG Optoelectronics project set out to demonstrate that optical waveguides incorporated within a backplane could benefit the system's interconnect topology. HDPUG facilitator Jack Fisher explains that a demonstrator has now been built and is currently under test at a number of leading OEMs.

Coast to Coast Circuits Talks Print-and-Etch Technology

I recently learned that a high-tech PCB supplier, Coast to Coast Circuits, had decided to provide their customers with quick-turn, high-value print-and-etch printed circuit boards. I talked with CEO Walt Stender and Marketing and Key Account Manager Michael Cisco, and I asked them to provide more details about this interesting decision.

Weiner’s World – March 2017

The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.

Stretching Beyond Flex

Emerging end-use electronic applications are driving dramatic innovations in circuit board and interconnection technology. New form factors, functionality and durability requirements are challenging the status quo for the PCB industry and pushing design, material and process development to the limit.

A Conversation with Gene Weiner

In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.

Capitol Connection: Drumroll, Please…Announcing the IPC Government IMPACT Awardees

Government relations are essential to our industry as many of the policy debates taking place will have long-lasting impact on our industry. Tax and regulations reform, immigration, and environmental regulations are up for debate and it is time for our industry to take a seat at the table.

EIPC Workshop on PCB BioMEMS

The Premier Inn conference centre at Heathrow Airport was the venue for the EIPC workshop on PCB BioMEMS. What, I hear you ask, is a PCB BioMEMS? This is an abbreviation for biomedical (or biological) microelectromechanical systems, otherwise known as lab-on-chip.

Mike Carano on the First PCB Executive Forum Held at IPC APEX EXPO 2017

When John Mitchell came on board as president of IPC, he decided to tap the members of the Raymond E. Pritchard Hall of Fame for suggestions and advice. So he established the IPC Ambassador Council and tasked them to create special programs for IPC conferences. It is this group of people who put together the recent PCB Executive Forum that was presented at IPC APEX EXPO 2017.

Inkjet Printing Solder Mask

Known for their film-based products, AgfaGevaert has turned its focus to the difficult task of inkjet printing solder mask by partnering with solder mask expert Electra Polymers. Sitting down with Frank Louwet and Mariana Van Dam of Agfa Specialty Products, Publisher Barry Matties and Technical Editor Pete Starkey learn more about the partnership and where they currently stand in the development of what will be a definite game changer.

RTW IPC APEX EXPO: New Dimensions in Fine-Pitch Probe Testing from Microcraft

MicroCraft introduces two new product lines. Regional Sales Manager Jesse Ziomek describes a flying-probe tester capable of hitting 0.4 mil pads at 2 mil pitch without sacrifice of testing speed, and a digital ink-jet printer able to print both solder resist and legend in the same cycle.

RTW IPC APEX EXPO: atg Luther & Maelzer's Fully Automated Probe Testing for High-Throughput HDI PCB Production

Klaus Koziol, director of sales at atg Luther & Maelzer, explains the rationale behind the development of the newly-introduced A8A from atg and discusses how the latestinnovations in high-accuracy automatic testing deliver high throughput whilst retaining the flexibility of flying-probe techniques.

RTW IPC APEX EXPO: Updates on Formulations for Direct Imaging and Inkjet Technologies

Chris Wall, technical director and Shaun Tibbals, sales and marketing director at Electra Polymers, review latest developments in digital imaging technologies for solder resist. Multi-wave direct imaging systems give more scope to the ink supplier to optimize formulation and offer improved flexibility of operation to the user.

RTW IPC APEX EXPO: ERP System Helps Gardien Ensure Global Consistency in Quality Assurance Services

How does a global provider of quality assurance services to the PCB industry give its customers the peace of mind that no matter where they utilize its services that they will always be to the same consistent high standard? Gardien Global VP of Quality Rick Meraw explains the benefits of an in-house-developed ERP system in driving efficiency and best practice throughout the organization.

RTW IPC APEX EXPO: John Davignon Offers HDPUG Update

The HDPUG (High-Density Packaging User Group) is an industry consortia designed to leverage members expertise to solve a variety of problems and issues affecting the electronics industry. Recent examples include the publication of project for the effects on back drilling on PTH reliability and reliability of press fit technology.

RTW CPCA: Helmut Fischer Discusses Solutions Approach in PCB Measurements

Dr. Wolfgang Babel, CEO and president of Helmut Fischer Group, discusses Industry 4.0, automation, and advanced solutions in PCB measurements.

Ray Pritchard Looks Back at IPC’s Beginning and His Role in Getting it Started

I have known Ray Pritchard for a long time—as long as I’ve been involved with IPC, in fact. He directed the organization for 35 years before turning over the reins. One could say he grew up with the organization—or vice versa. Ray was always a bundle of energy and still is, still joking and warm, a great people person, and I am sure he had a little something to do with the spirit of camaraderie and cooperation that is the hallmark of the IPC we know today.

The Wide World of Flex

In one sense the flexible circuit industry has remained amazingly stable. Polyimide remains the workhorse dielectric film; imaging is done by exposing a pattern on a photosensitive film; copper is subtractively removed from a patterned substrate; and crylic adhesive is commonly used to laminate polyimide coverlay as an insulation. But there have also been some rather dramatic changes...

RTW IPC APEX EXPO: ELCINA Inducted as a Member of WECC

WECC, the World Electronics Circuits Council, brings together industry trade associations worldwide to address issues of global importance. Secretary General Rex Rozario introduces Paresh Vasani, Honorary Secretary of ELCINA, the electronics industry association representing 300 companies in India, newly inducted as a member of WECC, and they discuss the significance of the relationship in the light of rapidly accelerating growth of electronics manufacturing in India.

The Near and Far Future for Orbotech and Inspection

Orbotech’s PCB Division President Arik Gordon and I spoke in detail about the company’s newest developments in automated optical shaping (AOS), Orbotech’s unique culture and commitment to R&D, and what he expects to see in the near future for the inspection industy.

RTW IPC APEX EXPO: HDPUG Discusses the Impact of Copper Bonding Treatment on Signal Integrity

Jim Fuller, vice president of engineering and technology development at Sanmina, gives an insight on how HDPUG, the High Density Packaging User Group, shares the experience and resources of member companies to tackle projects and get results, and reviews the study of the effect of copper bonding treatment on signal integrity.

Capitol Connection: Direct Legislative Action—IMPACT Washington, D.C. 2017

This ties in to why IPC–Association Connecting Electronics Industries invests so much into our government relations efforts. We place a high priority on government relations because so many public policy debates have large impacts on our industry. Our members continue to value our advocacy efforts on issues such as taxes, regulations, immigration and the environment.
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