Latest Articles

Shaun Tibbals and Electra Polymer: Finding the Silver Linings in COVID-19

On July 8, Nolan Johnson spoke with Shaun Tibbals, sales and marketing director for Electra Polymers. Shaun discusses the Electra Polymer’s business outlook responses to the ongoing COVID-19 outbreak.

Just Ask Happy: Resin-Filled Vias, Without Voids

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Nano Dimension Appoints LM Instruments to Market PCB/Hi-PEDs 3D-Printers

Nano Dimension Ltd., a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, has signed an agreement with LM Instruments, which will represent Nano Dimension in the Mid-Atlantic States by marketing its 3D-Fabrication Machines for High-Performance Electronic Devices (Hi-PEDs).

Focus on the Impact of Data

Nolan Johnson recently spoke with Dana Korf about his experience with total quality management (TQM) throughout his career. Dana recommends not getting stuck on the process of collecting the data and documenting it, but instead to look at the impact. If you haven’t made an impact, then you haven’t done a good job.

Understanding MIL-PRF-31032, Part 1

Over the course of this series, Anaya Vardya will discuss topics such as MIL-PRF-31032 requirements, the quality plan, responsibilities of the Technical Review Board (TRB), and the testing and reporting requirements for the certified shop into the DLA.

Chris Hanson: New Ventec IMS Dielectrics Rated for Higher Temps

Andy Shaughnessy recently spoke with Chris Hanson, global head of IMS Technology for Ventec International Group. During their conversation, Chris discusses his group’s recent efforts to create new IMS materials, with a focus on dielectrics. As Chris explains, Ventec has developed several new dielectrics that can withstand much higher operating temperatures, one of which is UL-rated for a maximum operating temp of 155°C, which may be the highest for an IMS dielectric.

Just Ask Happy: Calculating Trace Temps in a Vacuum

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The USMCA trade agreement was just the tip of the iceberg in news affecting our industry this week. We also saw more young people getting involved in the industry, an HDP User Group webinar on automotive thermal issues, and more questions for our own Happy Holden—this time, on stacked microvia reliability, or the lack thereof.

Just Ask Happy: Two-Layer Low-Speed PCBs

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Catching up With Fane Friberg: Supply Chain Management Expert

Dan Beaulieu recently spoke with Fane Friberg, principal at CEPHAS and a supply chain management expert, about how he started his company, as well as current market challenges he sees and what he thinks the future holds for companies—especially post-pandemic.

Materials for Automotive Applications: Thermal Management Issues

For Pete Starkey, the highlight of the recent HDP User Group Automotive Technology Webinar was Alun Morgan’s presentation on materials for automotive applications. This forward-looking informational session covered the latest developments in automotive standards and automotive electronic packaging.

IPC: Shawn DuBravac and Chris Mitchell on USMCA

On July 1, 2020, the USMCA trade act (United States-Mexico-Canada Act) phased in as a trade agreement guiding economic trade and growth in North America. Nolan Johnson spoke with both Shawn DuBravac, IPC’s chief economist, and Chris Mitchell, IPC’s vice president of global government affairs and an I-Connect007 columnist, about the impact of USMCA on North American electronics manufacturing.

Just Ask Happy: Stacked Microvia Reliability Issues

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Just Ask Happy: The Future of 3D Printing

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Updates on trade shows, conferences, and associations dominated industry news this past week. Some events are returning to a physical venue; others are opting for a virtual version in 2020. Add to that a spate of cross-association cooperative agreements and new programs for career development coming from multiple associations, and you’ve delivered four of my top five picks.

Just Ask Happy: The Future of Mechanical Blind, Buried Vias

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Just Ask Happy: The Proper Order of Design Techniques to Improve Connectivity

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between.

Happy Holden Is Taking Your Questions Now

Happy Holden, the industry icon and “Father of HDI,” is ready to answer your questions! What have you always wanted to ask Happy, but never thought you'd have the chance? Now is your chance! Please take a few minutes to jot down your questions for Happy. A select group of answers will be published in upcoming editions of I-Connect007 magazines and newsletters.

Elmatica’s Didrik Bech Accepts Role as IPC Cybersecurity Task Group Vice-Chair

On June 18, Nolan Johnson spoke with Didrik Bech, Elmatica CEO and I-Connect007 columnist, who was recently selected as vice-chair for IPC’s Cybersecurity Task Group. During their conversation, Didrik outlined the task group’s mission statement and the target audience for its work. He also shared specific examples where cybersecurity is increasingly important to the electronics manufacturing industry globally.

Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview

The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.

Dana Korf: What Fabricators Expect From Designers

Andy Shaughnessy and Barry Matties spoke with Dana Korf, former chief PCB technologist for Huawei and currently principal consultant of Korf Consultancy, about the breakdown in communication between manufacturers and designers. Dana discusses exactly what a fabricator expects from a PCB designer, why these expectations are often not met, and the need for designers to make mistakes so that they can learn from them.

Book Excerpt: Producing the Perfect Data Package, Part 2

The following is an excerpt from Chapter 2 of Mark Thompson's I-Connect007 eBook The Printed Circuit Designer’s Guide to... Producing the Perfect Data Package. Mark is in engineering support at Prototron Circuits and a Design007 Magazine columnist.

MTV Offers Solder Paste Testing Solution

The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.

This Month in PCB007 Magazine: Lessons Learned From Past Applications of TQM

Nolan Johnson spoke with Dan Feinberg about his experiences with TQM while serving as president of Dynachem and Morton Electronic Materials in the ‘90s. In this interview, Dan explains how TQM can sometimes be misidentified as a philosophy instead of a set of tools and processes focused on accomplishing business goals.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 2

The following is an excerpt from the second half of Chapter 1 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.
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