Latest Articles

EMS Leadership Summit Expands Its Reach

Nolan Johnson talks with Tracy Riggan, senior director of solutions, and Mark Wolfe, executive EMS advisor, both at IPC. They discuss details for the EMS Leadership Summit planned for IPC APEX EXPO 2022, how the summit program has changed from years past, and who should attend. Hint: Directors and above, along with any “rising star” managers. "It’s important in those discussions to have a wide breadth of ideas and learnings from different levels and roles of organizations," said Riggan. "We’re expanding that conversation by bringing in younger leaders, maybe those in management positions staged to be the next presidents and vice presidents of their organizations."

Altix Discusses Trends in U.S., European and Asian Markets

In this interview with European Editor Pete Starkey, Altix President Jerome Van Straaten, and Sales and Marketing Director Frederic Baradel discuss their strategies for addressing customers in the U.S. Europe, and Asia, as well as the trends they're seeing in technology around the globe. Check back for more coverage of productronica, as well as news about the upcoming conferences and trade shows in 2022.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It hardly feels like the end of 2021, but here we are, looking at a new year and IPC APEX EXPO and AltiumLive coming up in less than two months. If you don’t count days lost during the holidays, it’s more like one month before showtime. Hey, at least we have some live events to attend now. This week, we have some association and trade show news, as well as articles on data management and the diminished role of U.S. chip makers in the global electronics supply chain. We’re almost behind the eight-ball here, folks, and we can’t build chip factories overnight. Let’s get a move on!

Ron Lasky: A Perspective on Writing About Solder Defects

Nolan Johnson speaks with Dr. Ron Lasky About "The Printed Circuit Assembler’s Guide to... Solder Defects." Ron is a full professor at Dartmouth College, but works part-time at Indium Corporation, helping their customers solve defects. This I-Connect007 eBook, he says, is a compilation of all he’s learned over the years as well as the deep technical knowledge of the team at Indium.

EIPC Technical Snapshot Review: Semi-additive Processes

The development of ultra-high-density PCBs and packaging substrates using semi-additive and additive manufacturing processes was the theme of the 13th Technical Snapshot webinar presented by EIPC on November 24. It was introduced and moderated by technical director Tarja Rapala-Virtanen. Daniel Schulze, application engineering manager at Dyconex in Switzerland, gave the opening presentation, “Advanced high density rigid packaging substrates for RF and miniaturization.” He explained that with their long-established capabilities in ultra-high-density PCBs in flex, rigid-flex and rigid multilayer technologies, it was logical for Dyconex to apply their expertise to the development of specialist IC substrates.

Alex Stepinski: A Philosophical View

"My philosophy is to rely more on sensors throughout the process to measure things non-destructively, then build a model for how you’re going to perform, and just validate against the model," said Alex Stepinski. "It’s the next step slowly happening worldwide. For instance, we’ve had 2D AOI for many years. Sometimes, this is complemented with electrical tests. Now, you start to see more 3D AOI happening. You see them putting more sensors on the AOI equipment for direct measurement. Then, you also have the traditional signal integrity testing."

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

If you’re in the United States like I am, and if you celebrated with a traditional Thanksgiving dinner, like my family did, then you just might have fallen asleep sitting up in a chair (or in my case, stretched out on the couch) and missed some of the highlights in the news this week. Never fear, I woke up early to bring the top five news items you should know for this week. We have industry bookings and sales news from IPC, some news from the flex sector, an explanation of induction lamination from Happy Holden, and two different takes on “sustainability.”

Happy Thanksgiving From the I-Connect007 Team

In the United States, the Thanksgiving holiday is a celebration of gratitude and appreciation for the harvest and for the people close to us. Thankfulness, however, transcends just one day of official observance. The fourth Thursday of November is when the U.S. officially celebrates Thanksgiving Day and as we take time to observe this holiday, the I-Connect007 team wishes to offer our thanks to you, our global readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. You breathe life into the vital, thriving, world-changing electronics industry. You are the real story.

RBP Discusses New Management and Plans for the Future

Ernie Litynski, president of RBP Chemical Technology and Dan Carey, incoming executive vice president, brief Nolan Johnson on the recent organizational changes that brought Carey on board. Both Litynski and Carey outline how they see these changes benefiting their customers and partners, including in the defense and aerospace sectors. As they explain, it's their expertise at helping solve problems that customers value most.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This month—and this year, really—has just flown by. As someone mentioned to me recently, “There are basically only three full work weeks before New Year’s Day.” Yikes. Thanksgiving is next week, which means most of your customers and suppliers will be hard to reach. Unless there’s a problem, that is! In that case, they’ll find you, even if you’re carving a turkey with the kids and grandkids. So, with a short week on the horizon, most of us are in overdrive now, trying to get ahead of the game.

New Methods for Quantifying PCB Design Weaknesses and Manufacturing Challenges

Gerry Partida explains, "The industry is at a new point in evolving how we look at building boards. Our industry has historically built boards and then tried to find a test for them. Then, when they found a test for it, they figured out that it needed to be analyzed before they built the board. We did this with electrical test. We built boards and down the road, as people started asking, “Why am I buying bad boards? We should electrically test them,” electrical test was introduced, reluctantly, into the test part of manufacturing printed circuit boards by suppliers or fabricators. Then they embraced it. But when we started testing boards, we did comparison tests."

DuPont Discusses Acquisition of Rogers Corporation

Nolan Johnson gets the latest news from Avi Avula, vice president and general manager of Interconnect Solutions at DuPont, regarding the recent announcement of DuPont’s intent to acquire Rogers Corporation. Avula outlines the motivation for the acquisition, and how the two companies complement each other. Avula also gives some detail on how this might affect customers and business operations, under the proviso that it is early in the process and that many details have not yet been worked out.

Fascinating Opportunities in Flying Probe Testing

Pete Starkey visits with Peter Brandt, director of sales, Europe and Japan for atg Luther & Maelzer, who reflects upon joining the Mycronic group and goes on to discuss market and technology trends in testing, and what to expect from atg at this year’s productronica. "There are big challenges regarding accuracy and measurement methods for our flying probe. But this is a high-volume business. This means we only participate in smaller production quantities, because you can say 99.9% of this market for electrical testing will be covered by dedicated testers, using high-density, and high-cost fixtures," Brandt says.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Welcome to Friday in mid-November. If you're celebrating Thanksgiving, have you made up your menu and bought the turkey? It will be here before you know it. Around here, we're talking financial news and I've selected my top five financial news items of the week. There was plenty to choose from and my picks this week highlight a few of the most-read financial news pieces from our industry, as well as a couple high-interest technology related pieces. We also released our latest webinar, an 11-part series from the expert at GEN3. Definitely check that one out!

Aismalibar on Thermally-Conductive Solutions

Pete Starkey chats with Eduardo Benmayor about the products Aismalibar will be bringing to productronica 2021, and how the pandemic gave the company time to really work on internal processes.

Honoring Those Who Served

On this Veteran’s Day holiday, the I-Connect007 staff takes a moment to honor those men and women over the years, who served to protect and defend their country. Just on the I-Connect007 staff, we have loved ones who served, ranging from World War I to present-day active-duty military. The holiday isn’t intended to be a political statement, but rather a reflection on service, duty, and personal sacrifice. In some cases, the ultimate sacrifice. Our staff has submitted images of veterans who are near and dear to their hearts. Check them out!

Do You Really Need to Buy New Equipment?

When we began looking into CapEx strategies for PCB manufacturing, we ran into a few company owners who were proud of making their old fabrication equipment last for decades. We recently spoke about CapEx planning with Alex Stepinski, former VP of GreenSource Fabrication, who built a zero-wastewater PCB fabrication facility from the ground up. As Alex explains, your old equipment might actually last for decades, and if you need new equipment, you might find what you’re looking for in another industry.

Taiyo Discusses New Inkjet Technology and Solder Mask for Flex

At PCB West, Nolan Johnson spoke with Brian Wojtkiewicz of Taiyo about some of the company’s new inkjet technology, which will be manufactured in the U.S. Brian also discusses a new solder mask that has been developed especially for the flexible circuit segment of the industry. "They basically want to keep all the same specifications with regular solder mask, so we’re trying to keep all of that: the printability of it and how it looks. We’re getting a lot more interest on the colors. They just don’t want green anymore. They want it to be standard blue, reds, and whites and stuff like that."

I-Connect007 Editor's Choice: Five Must-Reads for the Week

It’s merger mania! Yes, there’s been a lot of M&A activity lately in our industry over the past few months. This week was no different when it comes to merger activities. In this week’s selections, we have news about DuPont’s acquisition of Rogers, Nano Dimension’s merger with Essemtec, and NCAB’s acquisition of Elmatica. We also have news from SMTA International, and an interview with Joe Clark of DownStream Technologies about their new flex and rigid-flex technology.

NCAB Discusses Recent Merger with Elmatica

I-Connect007’s Nolan Johnson catches up with Anders Forsén, chief financial officer at NCAB Group, to get an update on the recently announced acquisition of Elmatica by NCAB. In this audio interview from the NCAB headquarters in Sweden, Anders details how he sees Elmatica and NCAB working together to deliver a stronger solution for customers.

DFM 101: PCB Via Structures

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

Polar Instruments: Pandemic and Parts Shortage Lead to More R&D Time

During PCB West, I met with Geoffrey Hazelett, VP of sales for Polar Instruments. He explained how the pandemic actually helped Polar’s R&D in the long run, and why the current parts shortages may offer a similar benefit for OEMs, who can now spend more time in what he calls “forced R&D.”

Real Time With... productronica: SÜSS MicroTec on Supply Chain Options

Dr. Luca Gautero, product manager at SÜSS MicroTec, discusses marketing strategies for inkjet printing of solder mask, and explains how collaborative development along the supply chain has introduced new options for the designer and demonstrated the real benefits of this technology to the OEM.

I-Connect007 Editor’s Choice: Five Must Reads for the Week

This week’s top picks, as influenced by readership interest, don’t seem to hold to a particular theme. Previously, I’ve referred to this as a potpourri, and now that I’ve done that once, I can’t really do so again, can I? How about a mixed bag? No, I don’t think so. While the news is certainly a diverse assortment, this just feels too obvious.

Bring Our Industry Back? Shift Your Attitude

Dan Beaulieu discusses some comments he made in a recent column and why this is an opportunity for our industry in North America to retool, refocus, and make one fundamental shift in our plan to bring our industry back.
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