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Real Time with… SMTAI 2020: Reflections on the Technical Conference

This year’s SMTA International Conference and Exposition went virtual! Pete Starkey explains how the SMTA team did a fine job in difficult circumstances to present an interactive show and technical conference. Here, he highlights four of the papers that particularly caught his interest.

Combatting Thermal Challenges With TRM Software

Johannes Adam is the creator of a simulation tool called Thermal Risk Management (TRM) used to help PCB designers and design engineers predict hot spots on the board before during layout. He and Douglas Brooks, founder of UltraCAD Design, have used the tool to produce several technical articles and a book on the subject. In this interview, they tackle the biggest misconceptions they see from designers and engineers who deal with thermal management issues.

Real Time with… SMTAI 2020: Technical Conference Review

SMTAI 2020, which was converted to a virtual event, took place from September 28–30. I attend every year, but since there was no keynote in the virtual format, I went straight to the technical conference. This event covered a broad range of topics related to everything in assembly. Over 90 technical presentations are available, but this report covers just some of the sessions I attended.

My Experience at SMTAI 2020 Virtual

Denny Fritz shares his experience while attending SMTAI, concentrating on the exhibition portion of the virtual show. He also compliments SMTA on organizing and operating the virtual event.

Just Ask John Mitchell: The Exclusive Compilation

We asked for you to send in your questions for IPC President and CEO John Mitchell, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from John Mitchell, view his column series “One World, One Industry.”

Real Time with… SMTAI 2020: SMTA Announces Members of Distinction Annual Awards

SMTA recognized exceptional individual and corporate members for their immeasurable contributions to the association since 1994. And while the SMTA International Technical Committee announced the best presentation and paper awards from the 2019 conference on March 18, 2020, recipients were also recognized at SMTAI 2020.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Most all the action this week involved the STMA International Conference and Exposition. I-Connect007’s Real Time with… video interviews generally led the way for views and clicks. In each item, the intent was to make things better in some fashion. Whether it was pivoting on trade show delivery, optimizing the metalization process in the fab, adding more AI to manufacturing capital equipment, unifying and furthering the concept of the digital twin concept, or responding to company growth by upgrading systems with the help the equipment manufacturers, all these news items speak to being adaptable and forward-thinking.

Stop Relating Trace Temperature to Current Density

Many design engineers and even many software suppliers make the significant mistake of equating changes in trace or via temperature with current density. This is incorrect at best and dangerous at worst. There is little if any correlation between temperature and current density. Current and trace dimensions (among other things) are the relevant variables, but current density is not. I hope by the end of this article you will see why. Here are four illustrations that will help you understand this.

Real Time with...SMTAI 2020: MacDermid Alpha’s Single-Step Metalization Paper

Nolan Johnson talks with MacDermid Alpha Electronics Solutions about a new process for filling through-holes with copper in a single step. Carmichael Gugliotti, the primary author and an applications specialist, and Richard Bellemare, director of electrolytic metalization, address why this new process matters and what’s in Gugliotti’s technical paper presentation for SMTAI.

Just Ask John Mitchell: Blurring the Lines of Technology

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Just Ask John Mitchell: Plans For Knowledge Transfer?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Just Ask John Mitchell: Global Book-to-Bill Number

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Real Time with…SMTAI 2020: ASC Makes Lemonade Out of Lemons

Steve Williams and Anaya Vardya, president and CEO of American Standard Circuits (ASC), discuss the upcoming virtual SMTAI show and how the company is “making lemonade out of lemons.” As they point out, there may be no face-to-face interaction, but virtual shows are open to attendees from around the world with no travel or hotel costs. Anaya explains how the COVID-19 lockdown has caused ASC to become more creative in its marketing efforts, including holding webinars and publishing two eBooks with I-Connect007. They also discuss ASC’s holistic approach to the marketplace, with a diversified product mix across various segments.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In this week’s picks, we bring you news about the upcoming SMTA International 2020, IPC’s plans for the fall, a move for Burkle North America’s headquarters, and advice on how to select the correct CAD tool. And we have the first installment of our newest series: “Just Ask John Mitchell.”

Just Ask John Mitchell: Advice on Selling Tech in Asia

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Real Time with...SMTAI 2020: MacDermid Alpha’s Flash Etching Electroplating Paper

I-Connect007’s Nolan Johnson catches up with Sean Fleuriel, a chemist for MacDermid Alpha Electronics Solutions, and Richard Bellemare, director of electrolytic metalization, to discuss the SMTAI technical paper presented by Fleuriel, titled, “Pit Resistant Acid Copper Electroplating Process for Flash Etching.” Fleuriel and Bellemare highlight the challenges, processes, and conclusions from the paper, as well as which PCB fabricators are most likely to benefit from this new process.

Just Ask John Mitchell: Greenfield Capacity in North America?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Just Ask John Mitchell: Emerging Engineers and Managers

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! Today, John answers this question: Does IPC have an interest in emerging managers, as well as emerging engineers?

Just Ask John Mitchell: Are IPC’s Positions Dictated by Politics?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Two weeks ago, when it was my turn to pick the top 5, I made a comment about themes. I’m making a stretch here, but this week’s theme is technical education. Three out of the five most popular news items this last week reported on upcoming technical events or publications.

Mentor and Z-zero Collaborate on New Stackup Tool

I recently spoke with Max Clark, business unit manager with Mentor, a Siemens Business, and Z-zero founder Bill Hargin about the newly formed partnership that resulted in a new stackup tool that Mentor is now selling worldwide. Fun fact: Hargin used to work for Mentor as part of the HyperLynx team, which now has an interface with Z-planner Enterprise. Talk about coming full circle.

Real Time with…SMTAI 2020: KYZEN on How Maximized Stencil Life Improves Yields

KYZEN Executive Vice President Tom Forsythe shares company updates on stencil cleaning with Nolan Johnson. KYZEN recently announced its newest stencil cleaning product—KYZEN E5631. Forsythe details how the product is best used, as well as the benefits it brings to maximizing stencil life and improving manufacturing yields.

This Month in PCB007 Magazine: The Pillar Roadmap

As I spoke with Happy Holden about the four pillars of manufacturing, it became clear that they don’t stand on their own; they are intertwined. Happy pulls from his experience at Hewlett-Packard as he discusses benchmarking your capabilities, the competition, and market forces. He then turns that into a technology roadmap, which further drives the other pillars. Happy is adamant that to make all four pillars function properly in your business, you first need to benchmark your business and then create a roadmap. He says the roadmap identifies the specific functions required from the four pillars, and how each pillar supports the others.

Just Ask Eric: Selecting the Right Lead-Free Solder for Your Application

First, we asked you to send in your questions for Happy Holden and Joe Fjelstad in our “Just Ask” series. Now, it’s Eric Camden’s turn! A regular SMT007 columnist, Eric is a lead investigator at Foresite Inc., an analytical testing and consulting laboratory. As a reliability expert, Eric has worked with many large OEMs and contract manufacturing companies to optimize their manufacturing processes and assist with the identification of electronic hardware failures utilizing various analytical techniques. He also specializes in optimizing PCBA processes and identifying hardware failures through analysis. We hope you enjoy “Just Ask Eric.”

I-007eBook Review: Thermal Management From a Fabricator’s Perspective

The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator’s Perspective, written by Anaya Vardya, founder and CEO of American Standard Circuits, is an important book for a number of reasons. The most important reason is right there in the title; it is from the fabricator’s perspective. Besides explaining all aspects of thermal management—from thermal vias and metal-core boards to mixed technology—this book also describes the various applications of thermal dielectrics, their properties, and their incorporation into the actual fabrication of PCBs.
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