-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Multiline Technology Closes; Multiline International Europa Unaffected
September 23, 2016 | Multiline International EuropaEstimated reading time: 2 minutes
Multiline Technology closed its doors in June of 2016. However, Multiline International Europe (mie) remains active, robust and very much in business.
Multiline Technology started as Lenkeit Industries in the 1940s, as a tool and die-making business serving the electrical and automobile industries. Alfred Angelo became a partner in the 1950s and the sole owner in the 1970s. In the mid-1970s, Alfred’s older son, Michael, joined the company and steered it toward specialized tooling for the piercing and blanking of single-sided and punched-plated through printed circuits. When multilayer printed circuits began becoming wide-spread in the late 1970s largely because of the growth of the mini-computer industry, Lenkeit was well positioned to supply registration-slot punching dies to PCB fabricators in the United States and particularly to the burgeoning computer industry which at that time centered mostly in New England.
Paul Waldner was hired in 1980 to design a line of equipment including the Acculine laminate punch, the Optiline Artwork punch, the pre-preg punch, the depinner, the layup table and ultimately, the post-etch punch. Multiline Technology began as a division of Lenkeit Industries in 1981. In 1985, Lenkeit Industries abandoned its tool and die-making business and the remaining Lenkeit employees were integrated into Multiline Technology. Exports became an important part of Multiline’s business in the mid-‘80s. Paul Waldner and his family moved to Germany in 1987 to establish Multiline International Europe (mie).
Then mie expanded its business beyond the narrow focus of registration systems, although mie and Paul Waldner continued Multiline’s tradition of innovation as a source of product ideas, product development and product improvement. When mie and Paul Waldner were partners, from 1991 to 2015, mie became an important contributor to the state-of-the-art of imaging and exposure technology, laser drilling, X-ray registration drilling, registration of exposure and multilayer panels and multilayer pressing technology. Multiline International Europa and Multiline Technology and by extension, Michael Angelo and Paul Waldner, ended their partnership in 2015.
Today mie is the distributor throughout Europe, the Middle East and Africa (EMEA) for Fujifilm’s PCB products, and mie continues to offer registration solutions for their customers. In addition, mie has supply or cooperation agreements with:
- Innolas, a German producer of laser micro-machining and drilling machines
- Miva Technologies, a German producer of laser imaging solutions
- Entelechy, an engineering outsourcing service
- eSurface, offering fully additive and semi-additive circuit technology
- Echo Graphics, manufacturer of film developing and processing equipment
- Mie exposure machines, frames and accessories, consumables and spares for clean room and press room requirements
Many Multiline Technology customers are worried about how they will be able to maintain their machines into the future. Mie is offering reasonably priced upgrades of obsolete or unsupported elements of Multiline Technology machines and is committed to finding solutions for maintaining older Multiline Technology machines, both electrically and mechanically.
For further information, contact Paul Waldner at Multiline International Europa at +49-172-934-7401 or or pwaldner@mie.de.
Suggested Items
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.