-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
DesignCon 2017 Announces Heidi Barnes as Winner of the Engineer of the Year Award
February 3, 2017 | DesignConEstimated reading time: 2 minutes
DesignCon today announced Heidi Barnes of Keysight Technologies as the recipient of the 2017 Engineer of the Year Award. Selected for her dedication to problem solving and enthusiasm for leading and collaborating with teams, Barnes was awarded earlier today at DesignCon. The conference took place this week, January 31 – February 2, at the Santa Clara Convention Center. For additional information please visit: designcon.com.
"I am thrilled to be named the recipient of the Engineer of the Year Award by DesignCon," said Heidi Barnes, senior applications engineer for high speed digital applications in the EEs of EDA Group, Keysight Technologies. "We've made tremendous strides in this space and it's an honor to receive an award where industry luminaries including Eric Bogatin and Michael Steinberger were also named winners."
This prestigious award recognizes professionals in the engineering community that lead, develop and contribute to the design and test of chips, boards or systems. Award nominees were put forth by peers, finalists were carefully selected by the Design News editorial staff and the winner was voted for by the DesignCon community. With this achievement, Barnes will be provided with a $10,000 grant or scholarship that she has chosen to present to Harvey Mudd College.
Barnes is known for her ability to solve problems in the signal integrity (SI) and power integrity (PI) field for Fortune 500 companies, serves on the DesignCon Technical Program committee and leads conference planning as a co-chairperson for the test and measurement track. At DesignCon 2017, Barnes presented in technical sessions and tutorials on SI and PI, and participated in various panels.
"Heidi continuously proves her commitment to SI and PI with her involvement in DesignCon planning and presenting, and received an impressive seven nominations for the 2017 Engineer of the Year award," said Naomi Price, conference content director, DesignCon. "Her colleagues hold her in the highest regard for her ability to lead teams and develop thoughtful, logical and technical ideas, as she designs and works with some of the most complex channels and tools in the industry. Given these characteristics, it's no surprise she was selected as the award winner. I'd like to congratulate Heidi on receiving this recognition, and also congratulate the other award finalists."
Finalists for the 2017 Engineer of the Year award include Istvan Novak, senior principal engineer at Oracle, Krishnaswamy Ramkumar, senior technical staff member at Cypress Semiconductor, Ransom Stephens, principal at Ransom's Notes, and Yuriy Shlepnev, CEO at Simberian Inc.
For more information on DesignCon 2017 Engineer of the Year Award, please click here.
DesignCon Media & Association Partners
DesignCon is proud to partner with the following publications: Aspencore, Chinese American Semiconductor Professional Association (CASPA), Chip Design Magazine, ConnectorSupplier.com, EDA Café, Electronic System Design Alliance, Embedded Systems Engineering, How2Power, IBIS Open Forum, Microwave Journal, Signal Integrity Journal.
About DesignCon
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com/santaclara. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.
Suggested Items
Hirose Launches Solution Partner Network to Address Changing Design Challenges
05/06/2024 | HiroseHirose, a leader in the design and manufacturing of innovative connector solutions, has established a Solution Partner Network that enables OEMs to quickly explore product design, specialty IP, and component fulfillment options that best suit their needs.
New Yorker, Major League Electronics Sign New Franchised Distribution Agreement
05/06/2024 | New Yorker Electronics Co.New Yorker Electronics, global distributor of electronic components, recently announced a new franchised distribution agreement with Major League Electronics, renowned manufacturer of interconnect products.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.